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11 |
Material Type: Artigo
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Flexible and Efficient QoS Provisioning in AXI4-Based Network-on-Chip ArchitectureWang, Boqian ; Lu, ZhonghaiIEEE transactions on computer-aided design of integrated circuits and systems, 2022-05, Vol.41 (5), p.1523-1536 [Periódico revisado por pares]New York: IEEETexto completo disponível |
12 |
Material Type: Artigo
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System architecture and key technologies for 5G heterogeneous cloud radio access networksPeng, Mugen ; Li, Yong ; Zhao, Zhongyuan ; Wang, ChonggangIEEE network, 2015-03, Vol.29 (2), p.6-14 [Periódico revisado por pares]New York: IEEETexto completo disponível |
13 |
Material Type: Artigo
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Knights Landing: Second-Generation Intel Xeon Phi ProductSodani, Avinash ; Gramunt, Roger ; Corbal, Jesus ; Ho-Seop Kim ; Vinod, Krishna ; Chinthamani, Sundaram ; Hutsell, Steven ; Agarwal, Rajat ; Yen-Chen LiuIEEE MICRO, 2016-03, Vol.36 (2), p.34-46 [Periódico revisado por pares]Los Alamitos: IEEETexto completo disponível |
14 |
Material Type: Artigo
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A Survey on Evolutionary Neural Architecture SearchLiu, Yuqiao ; Sun, Yanan ; Xue, Bing ; Zhang, Mengjie ; Yen, Gary G. ; Tan, Kay ChenIEEE transaction on neural networks and learning systems, 2023-02, Vol.34 (2), p.550-570United States: IEEETexto completo disponível |
15 |
Material Type: Artigo
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Deep Federated Learning Enhanced Secure POI Microservices for Cyber-Physical SystemsGuo, Zhiwei ; Yu, Keping ; Lv, Zhihan ; Choo, Kim-Kwang Raymond ; Shi, Peng ; Rodrigues, Joel J. P. C.IEEE wireless communications, 2022-04, Vol.29 (2), p.22-29 [Periódico revisado por pares]New York: IEEETexto completo disponível |
16 |
Material Type: Artigo
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The ARM Scalable Vector ExtensionStephens, Nigel ; Biles, Stuart ; Boettcher, Matthias ; Eapen, Jacob ; Eyole, Mbou ; Gabrielli, Giacomo ; Horsnell, Matt ; Magklis, Grigorios ; Martinez, Alejandro ; Premillieu, Nathanael ; Reid, Alastair ; Rico, Alejandro ; Walker, PaulIEEE MICRO, 2017-03, Vol.37 (2), p.26-39 [Periódico revisado por pares]Los Alamitos: IEEETexto completo disponível |
17 |
Material Type: Artigo
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On-Chip Interconnection Architecture of the Tile ProcessorWentzlaff, D. ; Griffin, P. ; Hoffmann, H. ; Liewei Bao ; Edwards, B. ; Ramey, C. ; Mattina, M. ; Chyi-Chang Miao ; Brown, J.F. ; Agarwal, A.IEEE MICRO, 2007-09, Vol.27 (5), p.15-31 [Periódico revisado por pares]Los Alamitos: IEEETexto completo disponível |
18 |
Material Type: Artigo
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Software-defined network virtualization: an architectural framework for integrating SDN and NFV for service provisioning in future networksQiang Duan ; Ansari, Nirwan ; Toy, MehmetIEEE network, 2016-09, Vol.30 (5), p.10-16 [Periódico revisado por pares]New York: IEEETexto completo disponível |
19 |
Material Type: Artigo
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Constant Envelope Hybrid Precoding for Directional Millimeter-Wave CommunicationsHuang, Yongming ; Zhang, Jianjun ; Xiao, MingIEEE journal on selected areas in communications, 2018-04, Vol.36 (4), p.845-859 [Periódico revisado por pares]New York: IEEETexto completo disponível |
20 |
Material Type: Artigo
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Scene Recognition by Manifold Regularized Deep Learning ArchitectureYuan, Yuan ; Mou, Lichao ; Lu, XiaoqiangIEEE transaction on neural networks and learning systems, 2015-10, Vol.26 (10), p.2222-2233United States: IEEETexto completo disponível |