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Refinado por: Base de dados/Biblioteca: Copper Technical Reference Library remover assunto: Science & Technology remover Journal Of Materials Science remover
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Highly enhanced mechanical properties in Cu matrix composites reinforced with graphene decorated metallic nanoparticles
Highly enhanced mechanical properties in Cu matrix composites reinforced with graphene decorated metallic nanoparticles
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Highly enhanced mechanical properties in Cu matrix composites reinforced with graphene decorated metallic nanoparticles

Li, Meixia ; Che, Hongwei ; Liu, Xiaoyan ; Liang, Shunxing ; Xie, Hailong

Journal of materials science, 2014-05, Vol.49 (10), p.3725-3731 [Periódico revisado por pares]

Boston: Springer US

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2
Harmonic-structured copper: performance and proof of fabrication concept based on severe plastic deformation of powders
Harmonic-structured copper: performance and proof of fabrication concept based on severe plastic deformation of powders
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Harmonic-structured copper: performance and proof of fabrication concept based on severe plastic deformation of powders

Sawangrat, Choncharoen ; Kato, Shota ; Orlov, Dmitry ; Ameyama, Kei

Journal of materials science, 2014-10, Vol.49 (19), p.6579-6585 [Periódico revisado por pares]

Boston: Springer US

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3
Effect of PVA and copper oxide nanoparticles on the structural, optical, and electrical properties of carboxymethyl cellulose films
Effect of PVA and copper oxide nanoparticles on the structural, optical, and electrical properties of carboxymethyl cellulose films
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Effect of PVA and copper oxide nanoparticles on the structural, optical, and electrical properties of carboxymethyl cellulose films

El Sayed, A. M. ; El-Gamal, S. ; Morsi, W. M. ; Mohammed, Gh

Journal of materials science, 2015-07, Vol.50 (13), p.4717-4728 [Periódico revisado por pares]

New York: Springer US

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4
Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
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Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

Goh, Yingxin ; Haseeb, A. S. M. A. ; Liew, Haw Ling ; Sabri, Mohd Faizul Mohd

Journal of materials science, 2015-06, Vol.50 (12), p.4258-4269 [Periódico revisado por pares]

New York: Springer US

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5
Effect of copper foil annealing process on large graphene domain growth by solid source-based chemical vapor deposition
Effect of copper foil annealing process on large graphene domain growth by solid source-based chemical vapor deposition
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Effect of copper foil annealing process on large graphene domain growth by solid source-based chemical vapor deposition

Sharma, Kamal P. ; Shinde, Sachin M. ; Rosmi, Mohamad Saufi ; Sharma, Subash ; Kalita, Golap ; Tanemura, Masaki

Journal of materials science, 2016-08, Vol.51 (15), p.7220-7228 [Periódico revisado por pares]

New York: Springer US

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6
A comparison of microstructures and mechanical properties in a Cu–Zr alloy processed using different SPD techniques
A comparison of microstructures and mechanical properties in a Cu–Zr alloy processed using different SPD techniques
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A comparison of microstructures and mechanical properties in a Cu–Zr alloy processed using different SPD techniques

Wongsa-Ngam, Jittraporn ; Kawasaki, Megumi ; Langdon, Terence G.

Journal of materials science, 2013-07, Vol.48 (13), p.4653-4660 [Periódico revisado por pares]

Boston: Springer US

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7
Review: effect of bimetal interface structure on the mechanical behavior of Cu–Nb fcc–bcc nanolayered composites
Review: effect of bimetal interface structure on the mechanical behavior of Cu–Nb fcc–bcc nanolayered composites
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Review: effect of bimetal interface structure on the mechanical behavior of Cu–Nb fcc–bcc nanolayered composites

Mara, Nathan A. ; Beyerlein, Irene J.

Journal of materials science, 2014-10, Vol.49 (19), p.6497-6516 [Periódico revisado por pares]

Boston: Springer US

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8
Investigation of structural and electrical properties of novel CuO–PVA nanocomposite films
Investigation of structural and electrical properties of novel CuO–PVA nanocomposite films
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Investigation of structural and electrical properties of novel CuO–PVA nanocomposite films

Rao, Jammula Koteswara ; Raizada, Abhishek ; Ganguly, Debargha ; Mankad, Madri Manish ; Satayanarayana, S. V ; Madhu, G. M

Journal of materials science, 2015-11, Vol.50 (21), p.7064-7074 [Periódico revisado por pares]

New York: Springer US

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9
High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix
High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix
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High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix

Abyzov, Andrey M. ; Kidalov, Sergey V. ; Shakhov, Fedor M.

Journal of materials science, 2011-03, Vol.46 (5), p.1424-1438 [Periódico revisado por pares]

Boston: Springer US

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10
Mechanical properties of Cu–Cr system alloys with and without Zr and Ag
Mechanical properties of Cu–Cr system alloys with and without Zr and Ag
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Mechanical properties of Cu–Cr system alloys with and without Zr and Ag

Watanabe, Chihiro ; Monzen, Ryoichi ; Tazaki, Kazue

Journal of materials science, 2008-02, Vol.43 (3), p.813-819 [Periódico revisado por pares]

Boston: Springer US

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