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Recent studies on the light-induced phenomena in condensed matter systems and related numerical tools
Recent studies on the light-induced phenomena in condensed matter systems and related numerical tools
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Recent studies on the light-induced phenomena in condensed matter systems and related numerical tools

Shin Dongbin

Journal of the Korean Physical Society, 2022-10, p.707-714 [Periódico revisado por pares]

한국물리학회

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Novel quantum numbers in condensed matter physics
Novel quantum numbers in condensed matter physics
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Novel quantum numbers in condensed matter physics

J.R.Schrieffer

Current Applied Physics, 2004, 4(5), , pp.465-472 [Periódico revisado por pares]

한국물리학회

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3
High quality factor tuning fork resonators with various resonance frequencies
High quality factor tuning fork resonators with various resonance frequencies
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High quality factor tuning fork resonators with various resonance frequencies

Oh, Chan Young ; Hwang, Jonggeun ; Jhe, Wonho

Journal of the Korean Physical Society, 2023, Vol.82 (4), p.411-419 [Periódico revisado por pares]

Seoul: 한국물리학회

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Flexible (Ba0.7Sr0.3)TiO3 thick films with mechanically stable dielectric tunability
Flexible (Ba0.7Sr0.3)TiO3 thick films with mechanically stable dielectric tunability
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Flexible (Ba0.7Sr0.3)TiO3 thick films with mechanically stable dielectric tunability

Hong, Jung Ehy ; Hu, Ying Chieh ; Ko, Young Joon ; Jung, Jong Hoon ; Woo, Do Hyeon ; Koo, Chang Young

Journal of the Korean Physical Society, 2022-10, Vol.81 (7), p.664-668 [Periódico revisado por pares]

Seoul: 한국물리학회

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5
Strain-effect transistor with Y-shaped graphene junctions
Strain-effect transistor with Y-shaped graphene junctions
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Strain-effect transistor with Y-shaped graphene junctions

Myoung, Nojoon

Journal of the Korean Physical Society, 2022, 80(6), , pp.490-495 [Periódico revisado por pares]

Seoul: 한국물리학회

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6
Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology
Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology
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Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Sun, Yaqian ; Wang, Jing ; Zhang, Xundi ; Yang, Chenlin ; Hu, Anmin ; Hang, Tao ; Wu, Yunwen ; Ling, Huiqin ; Li, Ming

Electronic Materials Letters, 2021, 17(6), , pp.459-470 [Periódico revisado por pares]

Seoul: The Korean Institute of Metals and Materials

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7
Flexible thin-film GaAs solar cells with rear micro-pattern
Flexible thin-film GaAs solar cells with rear micro-pattern
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Flexible thin-film GaAs solar cells with rear micro-pattern

Jang, Yujeong ; Yun, Yeojun ; Moon, Sunghyun ; Lee, Minhyung ; Lee, Jaejin

Journal of the Korean Physical Society, 2021, 79(8), , pp.751-754 [Periódico revisado por pares]

Seoul: 한국물리학회

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8
Operation Range-Optimized Silver Nanowire Through Junction Treatment
Operation Range-Optimized Silver Nanowire Through Junction Treatment
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Operation Range-Optimized Silver Nanowire Through Junction Treatment

Lee, Jae-Chan ; Lee, Jong-Sung ; Won, Phillip ; Park, Jung Jae ; Choi, Seok Hwan ; Ko, Seung Hwan ; Kim, Byoung-Joon ; Lee, So-Yeon ; Joo, Young-Chang

Electronic Materials Letters, 2020, 16(5), , pp.491-497 [Periódico revisado por pares]

Seoul: The Korean Institute of Metals and Materials

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9
Critically Damped Verlet Algorithm for the Study of Structural Properties of Condensed Matter Systems
Critically Damped Verlet Algorithm for the Study of Structural Properties of Condensed Matter Systems
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Critically Damped Verlet Algorithm for the Study of Structural Properties of Condensed Matter Systems

Byeong June Min

Journal of the Korean Physical Society, 2005, 46(4), , pp.872-874 [Periódico revisado por pares]

한국물리학회

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10
3D flower-like hierarchical Ag@nickel-cobalt hydroxide microsphere with enhanced electrochemical properties
3D flower-like hierarchical Ag@nickel-cobalt hydroxide microsphere with enhanced electrochemical properties
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3D flower-like hierarchical Ag@nickel-cobalt hydroxide microsphere with enhanced electrochemical properties

Lv, Zijian ; Zhong, Qin ; Bu, Yunfei ; Wu, Junpeng

Electronic Materials Letters, 2016, 12(6), , pp.824-829 [Periódico revisado por pares]

Seoul: The Korean Institute of Metals and Materials

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