Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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11 |
Material Type: Ata de Congresso
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Reliability of SiC power devices and its influence on their commercialization - review, status, and remaining issuesTreu, M ; Rupp, R ; Solkner, G2010 IEEE International Reliability Physics Symposium, 2010, p.156-161IEEETexto completo disponível |
12 |
Material Type: Ata de Congresso
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Enhancement mode gallium nitride transistor reliabilityLidow, Alex ; Strittmatter, Rob ; Chunhua Zhou ; Yanping Ma2015 IEEE International Reliability Physics Symposium, 2015, p.2E.1.1-2E.1.5IEEETexto completo disponível |
13 |
Material Type: Ata de Congresso
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Recent advances in harsh environment acoustic wave sensors for contemporary applicationsda Cunha, M. Pereira ; Lad, R. J. ; Moonlight, T. ; Moulzolf, S. ; Canabal, A. ; Behanan, R. ; Davulis, P. M. ; Frankel, D. ; Bernhardt, G. ; Pollard, T. ; McCann, D. F.2011 IEEE SENSORS Proceedings, 2011, p.614-617IEEETexto completo disponível |
14 |
Material Type: Ata de Congresso
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Geant4 low energy electromagnetic physicsChauvie, S. ; Guatelli, S. ; Ivanchenko, V. ; Longo, F. ; Mantero, A. ; Mascialino, B. ; Nieminen, P. ; Pandola, L. ; Parlati, S. ; Peralta, L. ; Pia, M.G. ; Piergentili, M. ; Rodrigues, P. ; Saliceti, S. ; Tnndade, A.IEEE Symposium Conference Record Nuclear Science 2004, 2004, Vol.3, p.1881-1885 Vol. 3IEEETexto completo disponível |
15 |
Material Type: Ata de Congresso
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A case study of electromigration reliability: From design point to system operationsBaozhen Li ; Muller, Paul ; Warnock, James ; Sigal, Leon ; Badami, Dinesh2015 IEEE International Reliability Physics Symposium, 2015, p.2D.1.1-2D.1.6IEEETexto completo disponível |
16 |
Material Type: Ata de Congresso
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Evaluation of large volume SrI2(Eu) scintillator detectorsSturm, B W ; Cherepy, N J ; Drury, O B ; Thelin, P A ; Fisher, S E ; Magyar, A F ; Payne, S A ; Burger, A ; Boatner, L A ; Ramey, J O ; Shah, K S ; Hawrami, RIEEE Nuclear Science Symposuim & Medical Imaging Conference, 2010, p.1607-1611IEEETexto completo disponível |
17 |
Material Type: Ata de Congresso
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Numerical study of GaN-on-Si HEMT breakdown instability accounting for substrate and packaging interactionsMonti, F. ; Imperiale, I. ; Reggiani, S. ; Gnani, E. ; Gnudi, A. ; Baccarani, G. ; Nguyen, L. ; Hernandez-Luna, A. ; Huckabee, J. ; Tipirneni, N. ; Denison, M.2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 2015, p.381-384IEEETexto completo disponível |
18 |
Material Type: Ata de Congresso
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A W-band low-noise amplifier with 22K noise temperatureBryerton, E.W. ; Xiaobing Mei ; Young-Min Kim ; Deal, W. ; Yoshida, W. ; Lange, M. ; Uyeda, J. ; Morgan, M. ; Lai, R.2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.681-684IEEETexto completo disponível |
19 |
Material Type: Ata de Congresso
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Compressed ISAR autofocusing: Experimental resultsDaiyin Zhu ; Yong Li ; Xiang Yu ; Wei Zhang ; Zhaoda Zhu2012 IEEE Radar Conference, 2012, p.0425-0430IEEETexto completo disponível |
20 |
Material Type: Ata de Congresso
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Predictive simulation of CDM events to study effects of package, substrate resistivity and placement of ESD protection circuits on reliability of integrated circuitsShukla, Vrashank ; Jack, Nathan ; Rosenbaum, Elyse2010 IEEE International Reliability Physics Symposium, 2010, p.485-493IEEETexto completo disponível |