Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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Impact of the backside potential on the current collapse of GaN SBDs and HEMTsCroon, J. A. ; Hurkx, G. A. M. ; Donkers, J. J. T. M. ; Sonsky, J.2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), 2015, p.365-368IEEETexto completo disponível |
2 |
Material Type: Ata de Congresso
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Multi-lead organic air-cavity package for high power high frequency RFICsDougherty, D. ; Mahalingam, M. ; Viswanathan, V. ; Zimmerman, M.2009 IEEE MTT-S International Microwave Symposium Digest, 2009, p.473-476IEEETexto completo disponível |
3 |
Material Type: Ata de Congresso
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Wafer-level MEMS package and its reliability issuesTanaka, S. ; Esashi, M.2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.6B.1.1-6B.1.5IEEETexto completo disponível |
4 |
Material Type: Ata de Congresso
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Climbing Drum Peel (CDP) Test Method for Characterizing Adhesion in Flexible PV ModulesBheemreddy, Venkata ; Hardikar, Kedar2017 IEEE 44th Photovoltaic Specialist Conference (PVSC), 2017, p.2688-2691IEEETexto completo disponível |
5 |
Material Type: Ata de Congresso
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Large Area Nanostructure Integration for Broad-Spectrum, Omnidirectional Antireflection Improvements on Polymer Packaged, Mechanically Flexible, Epitaxial Lift-Off III-V Solar CellsCossio, Gabriel ; Jihwan Lee ; Ragunathan, Gautham ; Wibowo, Andre ; Tatavarti, Sudersena Rao ; Sablon, Kimberly ; Yu, Edward T.2017 IEEE 44th Photovoltaic Specialist Conference (PVSC), 2017, p.1181-1183IEEETexto completo disponível |
6 |
Material Type: Ata de Congresso
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Reliability of SiC power devices and its influence on their commercialization - review, status, and remaining issuesTreu, M ; Rupp, R ; Solkner, G2010 IEEE International Reliability Physics Symposium, 2010, p.156-161IEEETexto completo disponível |
7 |
Material Type: Ata de Congresso
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Enhancement mode gallium nitride transistor reliabilityLidow, Alex ; Strittmatter, Rob ; Chunhua Zhou ; Yanping Ma2015 IEEE International Reliability Physics Symposium, 2015, p.2E.1.1-2E.1.5IEEETexto completo disponível |
8 |
Material Type: Ata de Congresso
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Recent advances in harsh environment acoustic wave sensors for contemporary applicationsda Cunha, M. Pereira ; Lad, R. J. ; Moonlight, T. ; Moulzolf, S. ; Canabal, A. ; Behanan, R. ; Davulis, P. M. ; Frankel, D. ; Bernhardt, G. ; Pollard, T. ; McCann, D. F.2011 IEEE SENSORS Proceedings, 2011, p.614-617IEEETexto completo disponível |
9 |
Material Type: Ata de Congresso
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Geant4 low energy electromagnetic physicsChauvie, S. ; Guatelli, S. ; Ivanchenko, V. ; Longo, F. ; Mantero, A. ; Mascialino, B. ; Nieminen, P. ; Pandola, L. ; Parlati, S. ; Peralta, L. ; Pia, M.G. ; Piergentili, M. ; Rodrigues, P. ; Saliceti, S. ; Tnndade, A.IEEE Symposium Conference Record Nuclear Science 2004, 2004, Vol.3, p.1881-1885 Vol. 3IEEETexto completo disponível |
10 |
Material Type: Ata de Congresso
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Evaluation of large volume SrI2(Eu) scintillator detectorsSturm, B W ; Cherepy, N J ; Drury, O B ; Thelin, P A ; Fisher, S E ; Magyar, A F ; Payne, S A ; Burger, A ; Boatner, L A ; Ramey, J O ; Shah, K S ; Hawrami, RIEEE Nuclear Science Symposuim & Medical Imaging Conference, 2010, p.1607-1611IEEETexto completo disponível |