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Refinado por: data de publicação: 2004Até2010 remover data de publicação: 2005Até2005 remover tipo de recurso: Anais de Congresso remover
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1
Control of Period of Titiania-organic Hybrid Pillar Array Derived from Multi-beam Laser Interference Technique
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Control of Period of Titiania-organic Hybrid Pillar Array Derived from Multi-beam Laser Interference Technique

Segawa, H. ; Misawa, H.

2005 Pacific Rim Conference on Lasers & Electro-Optics, 2005, p.1633-1634

IEEE

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2
Fabrication and tests of a MEMS-based double-beam cantilever flow sensor with clarifying of temperature effect
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Fabrication and tests of a MEMS-based double-beam cantilever flow sensor with clarifying of temperature effect

Pang, Junguo ; Segawa, Takehiko ; Ikehara, Tsuyoshi ; Yoshida, Hiro ; Kikushima, Yoshihiro ; Abe, Hiroyuki ; Meada, Ryutaro

SPIE proceedings series, 2005, Vol.5649, p.253-264

Bellingham WA: SPIE

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3
Ultra-High-Speed Signal Propagation of High-Density Wiring Interposer for 3D Packaging
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Ultra-High-Speed Signal Propagation of High-Density Wiring Interposer for 3D Packaging

Kikuchi, K. ; Nakagawa, H. ; Tokoro, K. ; Aoyagi, M. ; Segawa, S.

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.809-813

IEEE

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4
Observations of exciton density of state variations in a ZnO thin film with fs pump-probe experiments
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Observations of exciton density of state variations in a ZnO thin film with fs pump-probe experiments

Cheng-Yen Chen ; Yen-Cheng Lu ; Hsiang-Chen Wang ; Fang-Yi Jen ; Yang, C.C. ; Zhang, B. ; Segawa, Y.

(CLEO). Conference on Lasers and Electro-Optics, 2005, 2005, Vol.1, p.621-623 Vol. 1

IEEE

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5
Wavelength Tunable Mode-Locked Semiconductor Lasers
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Wavelength Tunable Mode-Locked Semiconductor Lasers

Miyazu, J. ; Segawa, T. ; Matsuo, S. ; Ishii, T. ; Okamoto, H. ; Kondo, Y. ; Suzuki, H. ; Yoshikuni, Y.

2005 Pacific Rim Conference on Lasers & Electro-Optics, 2005, p.624-625

IEEE

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6
Fabrication process for high-density wiring interposer using photosensitive multiblock copolyimide insulation layers for 3D packaging
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Fabrication process for high-density wiring interposer using photosensitive multiblock copolyimide insulation layers for 3D packaging

Kikuchi, K. ; Oosato, H. ; Ito, S. ; Segawa, S. ; Nakagawa, H. ; Tokoro, K. ; Aoyagi, M.

2005 7th Electronic Packaging Technology Conference, 2005, Vol.2, p.4 pp.

IEEE

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