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Refinado por: data de publicação: 1997Até2011 remover tipo de recurso: Anais de Congresso remover
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1
Compact thermal modeling for temperature-aware design
Compact thermal modeling for temperature-aware design
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Compact thermal modeling for temperature-aware design

Huang, Wei ; Stan, Mircea R. ; Skadron, Kevin ; Sankaranarayanan, Karthik ; Ghosh, Shougata ; Velusam, Sivakumar

Proceedings of the 41st annual Design Automation Conference, 2004, p.878-883

New York, NY, USA: ACM

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2
Debugging reinvented: asking and answering why and why not questions about program behavior
Debugging reinvented: asking and answering why and why not questions about program behavior
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Debugging reinvented: asking and answering why and why not questions about program behavior

Ko, Amy J. ; Myers, Brad A.

International Conference on Software Engineering 2008, 2008, Vol.2008 (24), p.301-310

New York, NY, USA: ACM

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3
A practical guide for using statistical tests to assess randomized algorithms in software engineering
A practical guide for using statistical tests to assess randomized algorithms in software engineering
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A practical guide for using statistical tests to assess randomized algorithms in software engineering

Arcuri, Andrea ; Briand, Lionel

2011 33rd International Conference on Software Engineering (ICSE), 2011, p.1-10

New York, NY, USA: ACM

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4
Mixture importance sampling and its application to the analysis of SRAM designs in the presence of rare failure events
Mixture importance sampling and its application to the analysis of SRAM designs in the presence of rare failure events
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Mixture importance sampling and its application to the analysis of SRAM designs in the presence of rare failure events

Kanj, Rouwaida ; Joshi, Rajiv ; Nassif, Sani

2006 43rd ACM/IEEE Design Automation Conference, 2006, p.69-72

New York, NY, USA: ACM

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5
Chaff: engineering an efficient SAT solver
Chaff: engineering an efficient SAT solver
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Chaff: engineering an efficient SAT solver

Moskewicz, Matthew W. ; Madigan, Conor F. ; Zhao, Ying ; Zhang, Lintao ; Malik, Sharad

Proceedings of the 38th Design Automation Conference (IEEE Cat. No.01CH37232), 2001, p.530-535

New York, NY, USA: ACM

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6
Can recursive bisection alone produce routable placements?
Can recursive bisection alone produce routable placements?
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Can recursive bisection alone produce routable placements?

Caldwell, Andrew E. ; Kahng, Andrew B. ; Markov, Igor L.

Annual ACM IEEE Design Automation Conference: Proceedings of the 37th conference on Design automation; 05-09 June 2000, 2000, p.477-482

New York, NY, USA: ACM

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7
Recovery-driven design: a power minimization methodology for error-tolerant processor modules
Recovery-driven design: a power minimization methodology for error-tolerant processor modules
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Recovery-driven design: a power minimization methodology for error-tolerant processor modules

Kahng, Andrew B. ; Kang, Seokhyeong ; Kumar, Rakesh ; Sartori, John

Design Automation Conference, 2010, p.825-830

New York, NY, USA: ACM

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8
A 20-mW 640-MHz CMOS continuous-time ΣΔ ADC with 20-MHz signal bandwidth, 80-dB dynamic range and 12-bit ENOB
A 20-mW 640-MHz CMOS continuous-time ΣΔ ADC with 20-MHz signal bandwidth, 80-dB dynamic range and 12-bit ENOB
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A 20-mW 640-MHz CMOS continuous-time ΣΔ ADC with 20-MHz signal bandwidth, 80-dB dynamic range and 12-bit ENOB

MITTEREGGER, Gerhard ; EBNER, Christian ; MECHNIG, Stephan ; BLON, Thomas ; HOLUIGUE, Christophe ; ROMANI, Ernesto

IEEE journal of solid-state circuits, 2006, Vol.41 (12), p.2641-2649 [Periódico revisado por pares]

New York, NY: Institute of Electrical and Electronics Engineers

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9
Research through design as a method for interaction design research in HCI
Research through design as a method for interaction design research in HCI
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Research through design as a method for interaction design research in HCI

Zimmerman, John ; Forlizzi, Jodi ; Evenson, Shelley

Conference on Human Factors in Computing Systems: Proceedings of the SIGCHI conference on Human factors in computing systems; 28 Apr.-03 May 2007, 2007, p.493-502

New York, NY, USA: ACM

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10
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
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Thermal-aware cell and through-silicon-via co-placement for 3D ICs

Cong, Jason ; Luo, Guojie ; Shi, Yiyu

2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC), 2011, p.670-675

New York, NY, USA: ACM

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