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Material Type: Ata de Congresso
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A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performanceMehrotra, Vikas ; Sam, Shiou Lin ; Boning, Duane ; Chandrakasan, Anantha ; Vallishayee, Rakesh ; Nassif, SaniAnnual ACM IEEE Design Automation Conference: Proceedings of the 37th conference on Design automation; 05-09 June 2000, 2000, p.172-175New York, NY, USA: ACMTexto completo disponível |
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Material Type: Ata de Congresso
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A dual-core 64b ultraSPARC microprocessor for dense server applicationsTakayanagi, Toshinari ; Shin, Jinuk Luke ; Petrick, Bruce ; Su, Jeffrey ; Leon, Ana SoniaAnnual ACM IEEE Design Automation Conference: Proceedings of the 41st annual conference on Design automation; 07-11 June 2004, 2004, p.673-677New York, NY, USA: ACMTexto completo disponível |