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Material Type: Artigo
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Thermal modeling and analysis of 3D multi-processor chipsAyala, José L. ; Sridhar, Arvind ; Cuesta, DavidIntegration (Amsterdam), 2010-09, Vol.43 (4), p.327-341 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |