Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase CharacterizationLuu, Thi-Thuy ; Duan, Ani ; Aasmundtveit, Knut E. ; Hoivik, NilsJournal of electronic materials, 2013-12, Vol.42 (12), p.3582-3592 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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Material Type: Artigo
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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?Siow, Kim S.Journal of electronic materials, 2014-04, Vol.43 (4), p.947-961 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
3 |
Material Type: Artigo
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GaN Technology for Power Electronic Applications: A ReviewFlack, Tyler J. ; Pushpakaran, Bejoy N. ; Bayne, Stephen B.Journal of Electronic Materials, 2016-06, Vol.45 (6), p.2673-2682 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
4 |
Material Type: Artigo
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GaSb: A New Alternative Substrate for Epitaxial Growth of HgCdTeLei, W. ; Gu, R. J. ; Antoszewski, J. ; Dell, J. ; Faraone, L.Journal of electronic materials, 2014-08, Vol.43 (8), p.2788-2794 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
5 |
Material Type: Artigo
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A review on fabrication, sensing mechanisms and performance of metal oxide gas sensorsGardon, M. ; Guilemany, J. M.Journal of materials science. Materials in electronics, 2013-05, Vol.24 (5), p.1410-1421 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
6 |
Material Type: Artigo
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Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric MaterialsLin, T.Y. ; Liao, C.N. ; Wu, Albert T.Journal of electronic materials, 2012, Vol.41 (1), p.153-158 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
7 |
Material Type: Artigo
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Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing ProcessHwang, Seyeon ; Reyes, Edgar I. ; Moon, Kyoung-sik ; Rumpf, Raymond C. ; Kim, Nam SooJournal of electronic materials, 2015-03, Vol.44 (3), p.771-777 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
8 |
Material Type: Artigo
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A review of high-temperature electronics technology and applicationsWatson, Jeff ; Castro, GustavoJournal of Materials Science. Materials in Electronics, 2015-12, Vol.26 (12), p.9226-9235 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
9 |
Material Type: Artigo
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A Critical Review of the Role of Carbon Nanotubes in the Progress of Next-Generation Electronic ApplicationsMaheswaran, Rajalakshmi ; Shanmugavel, Balasivanandha PrabuJournal of electronic materials, 2022, Vol.51 (6), p.2786-2800 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
10 |
Material Type: Artigo
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Fabrication of a Flexible Bismuth Telluride Power Generation Module Using Microporous Polyimide Films as SubstratesKato, Kunihisa ; Hatasako, Yoshika ; Kashiwagi, Makoto ; Hagino, Harutoshi ; Adachi, Chihaya ; Miyazaki, KojiJournal of electronic materials, 2014-06, Vol.43 (6), p.1733-1739 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |