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11
βSn grain boundary structure and self-diffusivity via molecular dynamics simulation
βSn grain boundary structure and self-diffusivity via molecular dynamics simulation
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βSn grain boundary structure and self-diffusivity via molecular dynamics simulation

Sellers, Michael S. ; Schultz, Andrew J. ; Basaran, Cemal ; Kofke, David A.

Proceedings of the 2011 Grand Challenges on Modeling and Simulation Conference, 2011, p.321-332

Vista, CA: Society for Modeling & Simulation International

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12
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
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Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging

Basaran, Cemal ; Gomez, Juan ; Lin, Minghui ; Li, Shidong

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.269-275

San Diego, CA, USA: Society for Computer Simulation International

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13
Strain energy change due to an atomic defect in solder alloy lattice
Strain energy change due to an atomic defect in solder alloy lattice
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Strain energy change due to an atomic defect in solder alloy lattice

Basaran, Cemal ; Sellers, Michael ; Kofke, David ; Schultz, Andrew

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.1-1

San Diego, CA, USA: Society for Computer Simulation International

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14
An analytical model for thermal stress analysis of multi-layered microelectronics packaging
An analytical model for thermal stress analysis of multi-layered microelectronics packaging
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An analytical model for thermal stress analysis of multi-layered microelectronics packaging

Yujun Wen ; Basaran, C.

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1592-1601 Vol.2

Piscataway NJ: IEEE

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15
Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model
Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model
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Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model

Gomez, J. ; Basaran, C.

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1006-1015 Vol. 1

IEEE

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16
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
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Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing

Hua Ye ; Basaran, C. ; Hopkins, D.C. ; Minghui Lin

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1437-1444 Vol. 2

IEEE

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17
A thermodynamic model for electrical current induced damage
A thermodynamic model for electrical current induced damage
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A thermodynamic model for electrical current induced damage

Basaran, C. ; Minghui Lin ; Hua Ye

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1738-1745 Vol.2

Piscataway NJ: IEEE

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18
Damage mechanics of microelectronics solder joints under high current densities
Damage mechanics of microelectronics solder joints under high current densities
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Damage mechanics of microelectronics solder joints under high current densities

Hua Ye ; Basaran, C. ; Hopkins, D.C. ; Frear, D. ; Jong-Kai Lin

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.988-997 Vol.1

Piscataway NJ: IEEE

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19
A Numerical Investigation of the Gap Effect on the Condensation Heat Transfer in Vertical Mini-Channels with Various Wettability Conditions
A Numerical Investigation of the Gap Effect on the Condensation Heat Transfer in Vertical Mini-Channels with Various Wettability Conditions
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A Numerical Investigation of the Gap Effect on the Condensation Heat Transfer in Vertical Mini-Channels with Various Wettability Conditions

Son, Hyo Je ; Lee, Hanchoon ; Yang, Jae Sung ; Jung, Seungmo ; Ha, Man Yeong ; Min, June Kee

ASHRAE transactions, 2022, Vol.128 (1), p.50-58 [Periódico revisado por pares]

Atlanta: American Society of Heating, Refrigerating, and Air-Conditioning Engineers, Inc. (ASHRAE)

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20
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
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Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects

Croes, K. ; Li, Y. ; Lofrano, M. ; Wilson, C. J. ; Tokei, Z.

2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.2C.3.1-2C.3.4

IEEE

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