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Refinado por: data de publicação: 2005Até2007 remover tipo de recurso: Anais de Congresso remover
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1
Computational simulation of electromigration induced damage in copper interconnects
Computational simulation of electromigration induced damage in copper interconnects
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Computational simulation of electromigration induced damage in copper interconnects

Basaran, Cemal ; Lin, Minghui ; Li, Shidong

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.261-268

San Diego, CA, USA: Society for Computer Simulation International

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2
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
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Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging

Basaran, Cemal ; Gomez, Juan ; Lin, Minghui ; Li, Shidong

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.269-275

San Diego, CA, USA: Society for Computer Simulation International

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3
Strain energy change due to an atomic defect in solder alloy lattice
Strain energy change due to an atomic defect in solder alloy lattice
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Strain energy change due to an atomic defect in solder alloy lattice

Basaran, Cemal ; Sellers, Michael ; Kofke, David ; Schultz, Andrew

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.1-1

San Diego, CA, USA: Society for Computer Simulation International

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4
Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model
Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model
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Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model

Gomez, J. ; Basaran, C.

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1006-1015 Vol. 1

IEEE

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5
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing
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Modeling deformation in microelectronics BGA solder joints under high current density. Part I. Simulation and testing

Hua Ye ; Basaran, C. ; Hopkins, D.C. ; Minghui Lin

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1437-1444 Vol. 2

IEEE

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