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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Ata de Congresso
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Statistical phase shifting step estimation based on continuous wavelet transform for high resolution interferometry metrologyBicheng Chen ; Basaran, Cemal2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-6IEEETexto completo disponível |
| 2 |
Material Type: Ata de Congresso
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Low temperature electromigration and thermomigration in lead-free solder jointsHamid, Mohd Foad Abdul ; Basaran, Cemal2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-6IEEETexto completo disponível |
| 3 |
Material Type: Ata de Congresso
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Reliability of indium solder die bonding of high power cm-barsLu Guoguang ; Huang Yun ; En Yunfei2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 2010, p.968-972IEEETexto completo disponível |
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Assunto
- Engineering, Electrical & Electronic (2)
- Engineering (2)
- Testing (2)
- Science & Technology (2)
- Technology (2)
- Indium (1)
- Continuous Wavelet Transforms (1)
- Environmentally Friendly Manufacturing Techniques (1)
- Continuous Wavelet Transform (1)
- Electromigration (1)
- Electrons (1)
- Heating (1)
- Degradation (1)
- Lifetime Estimation (1)
- Passivation (1)
- Numerical Simulation (1)
- Metrology (1)
- Lead (1)
- Current Density (1)
- Calibration (1)
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