Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Torque-maximizing field-weakening control: design, analysis, and parameter selectionHarnefors, L. ; Pietilainen, K. ; Gertmar, L.IEEE transactions on industrial electronics (1982), 2001-02, Vol.48 (1), p.161-168 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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On the Distribution of AC and DC Winding Capacitances in High-Frequency Power Transformers With Rectifier LoadsRanstad, P ; Nee, Hans-PeterIEEE transactions on industrial electronics (1982), 2011-05, Vol.58 (5), p.1789-1798 [Periódico revisado por pares]New York: IEEETexto completo disponível |
3 |
Material Type: Artigo
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Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICsNiklaus, Frank ; Decharat, Adit ; Forsberg, Fredrik ; Roxhed, Niclas ; Lapisa, Martin ; Populin, Michael ; Zimmer, Fabian ; Lemm, Jörn ; Stemme, GöranSensors and actuators. A. Physical., 2009-08, Vol.154 (1), p.180-186 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
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Material Type: Artigo
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On the Physical Limitations of the Interaction of a Spherical Aperture and a Random FieldGlazunov, Andrés Alayon ; Gustafsson, M ; Molisch, A FIEEE transactions on antennas and propagation, 2011-01, Vol.59 (1), p.119-128 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
5 |
Material Type: Ata de Congresso
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Guaranteed bandwidth using looped containers in temporally disjoint networks within the nostrum network on chipMillberg, M. ; Nilsson, E. ; Thid, R. ; Jantsch, A.Design, Automation And Test In Europe Conference And Exhibition, Vols 1 And 2, Proceedings, 2004, Vol.2, p.890-895 Vol.2IEEETexto completo disponível |
6 |
Material Type: Artigo
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Small footprint wafer-level vacuum packaging using compressible gold sealing ringsAntelius, Mikael ; Stemme, Göran ; Niklaus, FrankJournal of micromechanics and microengineering, 2011-08, Vol.21 (8), p.085011-6 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
7 |
Material Type: Artigo
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Wire-bonded through-silicon vias with low capacitive substrate couplingFISCHER, A. C ; GRANGE, M ; ROXHED, N ; WEERASEKERA, R ; PAMUNUWA, D ; STEMME, G ; NIKLAUS, FJournal of micromechanics and microengineering, 2011-08, Vol.21 (8), p.85035-8 [Periódico revisado por pares]Bristol: Institute of PhysicsTexto completo disponível |
8 |
Material Type: Artigo
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Highly mass-sensitive thin film plate acoustic resonators (FPAR)Arapan, Lilia ; Alexieva, Gergana ; Avramov, Ivan D ; Radeva, Ekaterina ; Strashilov, Vesseline ; Katardjiev, Ilia ; Yantchev, VentsislavSensors (Basel, Switzerland), 2011-07, Vol.11 (7), p.6942-6953 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
9 |
Material Type: Artigo
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Sensitivity Features of Thin Film Plate Acoustic Wave ResonatorsArapan, L. ; Anderas, E. ; Katardjiev, I. ; Yantchev, V.IEEE sensors journal, 2011-12, Vol.11 (12), p.3330-3331 [Periódico revisado por pares]New York: IEEETexto completo disponível |
10 |
Material Type: Artigo
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Room-Temperature Sealing of Microcavities by Cold Metal WeldingDecharat, A. ; Junchun Yu ; Boers, M. ; Stemme, G. ; Niklaus, F.Journal of microelectromechanical systems, 2009-12, Vol.18 (6), p.1318-1325 [Periódico revisado por pares]New York: IEEETexto completo disponível |