Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Pattern transfer on a vertical cavity sidewall using SU8Verhaar, T M ; Wei, J ; Sarro, P MJournal of micromechanics and microengineering, 2009-07, Vol.19 (7), p.074018-074018 (6) [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
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2 |
Material Type: Artigo
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A multi-stage attack mitigation mechanism for software-defined home networksLuo, Shibo ; Wu, Jun ; Li, Jianhua ; Guo, LonghuaIEEE transactions on consumer electronics, 2016-05, Vol.62 (2), p.200-207 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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3 |
Material Type: Artigo
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Process variation in embedded memories: failure analysis and variation aware architectureAgarwal, A. ; Paul, B.C. ; Mukhopadhyay, S. ; Roy, K.IEEE journal of solid-state circuits, 2005-09, Vol.40 (9), p.1804-1814 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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4 |
Material Type: Artigo
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0.9–10.6 GHz UWB mixer using current bleeding for multi-band applicationYeh, Chin-I ; Feng, Wu-Shiung ; Hsu, Chen-YuElectronics letters, 2014-01, Vol.50 (3), p.186-187 [Periódico revisado por pares]Stevenage: The Institution of Engineering and TechnologyTexto completo disponível |
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5 |
Material Type: Artigo
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OTDM add-drop multiplexer based on XPM-induced wavelength shifting in highly nonlinear fiberJie Li ; Olsson, B.-E. ; Karlsson, M. ; Andrekson, P.A.Journal of lightwave technology, 2005-09, Vol.23 (9), p.2654-2661 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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6 |
Material Type: Artigo
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Correlation-sensitive adaptive sequence detectionKavcic, A. ; Moura, J.M.F.IEEE transactions on magnetics, 1998-05, Vol.34 (3), p.763-771New York, NY: IEEETexto completo disponível |
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7 |
Material Type: Artigo
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A review: On the development of low melting temperature Pb-free soldersKotadia, Hiren R. ; Howes, Philip D. ; Mannan, Samjid H.Microelectronics and reliability, 2014-06, Vol.54 (6-7), p.1253-1273 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
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8 |
Material Type: Artigo
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A review of lead-free solders for electronics applicationsCheng, Shunfeng ; Huang, Chien-Ming ; Pecht, MichaelMicroelectronics and reliability, 2017-08, Vol.75, p.77-95 [Periódico revisado por pares]Elsevier LtdTexto completo disponível |
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9 |
Material Type: Artigo
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A review of MEMS oscillators for frequency reference and timing applicationsvan Beek, J T M ; Puers, RJournal of micromechanics and microengineering, 2012-01, Vol.22 (1), p.013001-35 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
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10 |
Material Type: Artigo
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Hyperelastic pressure sensing with a liquid-embedded elastomerPark, Yong-Lae ; Majidi, Carmel ; Kramer, Rebecca ; Bérard, Phillipe ; Wood, Robert JJournal of micromechanics and microengineering, 2010-12, Vol.20 (12), p.125029 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |