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1
An Analytical Model of Dynamic Power Losses in eGaN HEMT Power Devices
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An Analytical Model of Dynamic Power Losses in eGaN HEMT Power Devices

Lei, Jianming ; Liu, Yangyi ; Yang, Zhanmin ; Chen, Yalin ; Chen, Dunjun ; Xu, Liang ; Yu, Jing

Micromachines (Basel), 2023-08, Vol.14 (8), p.1633 [Periódico revisado por pares]

Basel: MDPI AG

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2
Analytical Evaluation and Experiment of the Dynamic Characteristics of Double-Thimble-Type Fiber Bragg Grating Temperature Sensors
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Analytical Evaluation and Experiment of the Dynamic Characteristics of Double-Thimble-Type Fiber Bragg Grating Temperature Sensors

Luo, Chuan ; Wang, Han ; Zhang, Dacheng ; Zhao, Zhengang ; Li, Yingna ; Li, Chuan ; Liang, Ke

Micromachines (Basel), 2020-12, Vol.12 (1), p.16 [Periódico revisado por pares]

Switzerland: MDPI AG

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3
Fluid Flow Dynamics in Partially Saturated Paper
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Fluid Flow Dynamics in Partially Saturated Paper

Kumar, Ashutosh ; Hatayama, Jun ; Soucy, Alex ; Carpio, Ethan ; Rahmani, Nassim ; Anagnostopoulos, Constantine ; Faghri, Mohammad

Micromachines (Basel), 2024-01, Vol.15 (2), p.212 [Periódico revisado por pares]

Switzerland: MDPI AG

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4
Design and Analysis of a High-Gain and Robust Multi-DOF Electro-thermally Actuated MEMS Gyroscope
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Design and Analysis of a High-Gain and Robust Multi-DOF Electro-thermally Actuated MEMS Gyroscope

Saqib, Muhammad ; Mubasher Saleem, Muhammad ; Mazhar, Naveed ; Awan, Saif Ullah ; Shahbaz Khan, Umar

Micromachines (Basel), 2018-11, Vol.9 (11), p.577 [Periódico revisado por pares]

Switzerland: MDPI AG

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5
Squeezing Dynamic Mechanism of High-Viscosity Droplet and its Application for Adhesive Dispensing in Sub-Nanoliter Resolution
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Squeezing Dynamic Mechanism of High-Viscosity Droplet and its Application for Adhesive Dispensing in Sub-Nanoliter Resolution

Zhu, Ping ; Xu, Zheng ; Xu, Xiaoyu ; Wang, Dazhi ; Wang, Xiaodong ; Yan, Ying ; Wang, Liding

Micromachines (Basel), 2019-10, Vol.10 (11), p.728 [Periódico revisado por pares]

Switzerland: MDPI AG

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6
Analytical Solution of Time-Periodic Electroosmotic Flow through Cylindrical Microchannel with Non-Uniform Surface Potential
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Analytical Solution of Time-Periodic Electroosmotic Flow through Cylindrical Microchannel with Non-Uniform Surface Potential

Khan, Aminul Islam ; Dutta, Prashanta

Micromachines (Basel), 2019-07, Vol.10 (8), p.498 [Periódico revisado por pares]

Switzerland: MDPI AG

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7
The Analysis of the Influence of Threshold on the Dynamic Contact Process of a Fabricated Vertically Driven MEMS Inertial Switch
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The Analysis of the Influence of Threshold on the Dynamic Contact Process of a Fabricated Vertically Driven MEMS Inertial Switch

Chen, Wenguo ; Wang, Rui ; Wang, Huiying ; Kong, Dejian ; Sun, Shulei

Micromachines (Basel), 2019-11, Vol.10 (11), p.791 [Periódico revisado por pares]

Switzerland: MDPI AG

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8
Development and Evaluation of a Flexible PVDF-Based Balloon Sensor for Detecting Mechanical Forces at Key Esophageal Nodes in Esophageal Motility Disorders
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Development and Evaluation of a Flexible PVDF-Based Balloon Sensor for Detecting Mechanical Forces at Key Esophageal Nodes in Esophageal Motility Disorders

Ran, Peng ; Li, Minchuan ; Zhang, Kunlin ; Sun, Daming ; Lai, Yingbing ; Liu, Wei ; Zhong, Ying ; Li, Zhangyong

Biosensors (Basel), 2023-08, Vol.13 (8), p.791 [Periódico revisado por pares]

Basel: MDPI AG

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9
Usable Analytical Expressions for Temperature Distribution Induced by Ultrafast Laser Pulses in Dielectric Solids
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Usable Analytical Expressions for Temperature Distribution Induced by Ultrafast Laser Pulses in Dielectric Solids

Que, Ruyue ; Lancry, Matthieu ; Poumellec, Bertrand

Micromachines (Basel), 2024-01, Vol.15 (2), p.196 [Periódico revisado por pares]

Switzerland: MDPI AG

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10
A Multi-Point Contact Model Considering Rough Surface for Linear Ultrasonic Motors: Validation and Simulation
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A Multi-Point Contact Model Considering Rough Surface for Linear Ultrasonic Motors: Validation and Simulation

He, Ying ; Yao, Zhiyuan ; Xu, Hao

Micromachines (Basel), 2022-11, Vol.13 (11), p.1988 [Periódico revisado por pares]

Basel: MDPI AG

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