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Refinado por: Nome da Publicação: Micromachines remover
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11
High Selectivity, Low Damage ICP Etching of p -GaN over AlGaN for Normally-off p -GaN HEMTs Application
High Selectivity, Low Damage ICP Etching of p -GaN over AlGaN for Normally-off p -GaN HEMTs Application
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High Selectivity, Low Damage ICP Etching of p -GaN over AlGaN for Normally-off p -GaN HEMTs Application

Zhang, Penghao ; Wang, Luyu ; Zhu, Kaiyue ; Yang, Yannan ; Fan, Rong ; Pan, Maolin ; Xu, Saisheng ; Xu, Min ; Wang, Chen ; Wu, Chunlei ; Zhang, David Wei

Micromachines (Basel), 2022-04, Vol.13 (4), p.589 [Periódico revisado por pares]

Switzerland: MDPI AG

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12
Fabrication of Ordered Macropore Arrays in n-Type Silicon Wafer by Anodic Etching Using Double-Tank Electrochemical Cell
Fabrication of Ordered Macropore Arrays in n-Type Silicon Wafer by Anodic Etching Using Double-Tank Electrochemical Cell
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Fabrication of Ordered Macropore Arrays in n-Type Silicon Wafer by Anodic Etching Using Double-Tank Electrochemical Cell

Zhang, Jing ; Zhang, Faqiang ; Ma, Mingsheng ; Liu, Zhifu

Micromachines (Basel), 2024-04, Vol.15 (5), p.569 [Periódico revisado por pares]

Switzerland: MDPI AG

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13
On reactive Ion Etching of Parylene-C with Simple Photoresist Mask for Fabrication of High Porosity Membranes to Capture Circulating and Exfoliated Tumor Cells
On reactive Ion Etching of Parylene-C with Simple Photoresist Mask for Fabrication of High Porosity Membranes to Capture Circulating and Exfoliated Tumor Cells
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On reactive Ion Etching of Parylene-C with Simple Photoresist Mask for Fabrication of High Porosity Membranes to Capture Circulating and Exfoliated Tumor Cells

Rabadi, Inad ; Carpentieri, David ; Wang, Jue ; Zenhausern, Frederic ; Gu, Jian

Micromachines (Basel), 2024-04, Vol.15 (4), p.521 [Periódico revisado por pares]

Switzerland: MDPI AG

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14
Improving Performance and Breakdown Voltage in Normally-Off GaN Recessed Gate MIS-HEMTs Using Atomic Layer Etching and Gate Field Plate for High-Power Device Applications
Improving Performance and Breakdown Voltage in Normally-Off GaN Recessed Gate MIS-HEMTs Using Atomic Layer Etching and Gate Field Plate for High-Power Device Applications
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Improving Performance and Breakdown Voltage in Normally-Off GaN Recessed Gate MIS-HEMTs Using Atomic Layer Etching and Gate Field Plate for High-Power Device Applications

Liu, An-Chen ; Tu, Po-Tsung ; Chen, Hsin-Chu ; Lai, Yung-Yu ; Yeh, Po-Chun ; Kuo, Hao-Chung

Micromachines (Basel), 2023-08, Vol.14 (8), p.1582 [Periódico revisado por pares]

Basel: MDPI AG

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15
Batch Fabrication of Microelectrode Arrays with Glassy Carbon Microelectrodes and Interconnections for Neurochemical Sensing: Promises and Challenges
Batch Fabrication of Microelectrode Arrays with Glassy Carbon Microelectrodes and Interconnections for Neurochemical Sensing: Promises and Challenges
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Batch Fabrication of Microelectrode Arrays with Glassy Carbon Microelectrodes and Interconnections for Neurochemical Sensing: Promises and Challenges

Faul, Emma-Bernadette A ; Broussard, Austin M ; Rivera, Daniel R ; Pwint, May Yoon ; Wu, Bingchen ; Cao, Qun ; Bailey, Davis ; Cui, X Tracy ; Castagnola, Elisa

Micromachines (Basel), 2024-02, Vol.15 (2), p.277 [Periódico revisado por pares]

Switzerland: MDPI AG

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16
Fabrication of Ultra-High Aspect Ratio (>420:1) Al2O3 Nanotube Arraysby Sidewall TransferMetal Assistant Chemical Etching
Fabrication of Ultra-High Aspect Ratio (>420:1) Al2O3 Nanotube Arraysby Sidewall TransferMetal Assistant Chemical Etching
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Fabrication of Ultra-High Aspect Ratio (>420:1) Al2O3 Nanotube Arraysby Sidewall TransferMetal Assistant Chemical Etching

Li, Hailiang ; Xie, Changqing

Micromachines (Basel), 2020-04, Vol.11 (4), p.378 [Periódico revisado por pares]

Basel: MDPI AG

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17
InGaN Laser Diodes with Etched Facets for Photonic Integrated Circuit Applications
InGaN Laser Diodes with Etched Facets for Photonic Integrated Circuit Applications
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InGaN Laser Diodes with Etched Facets for Photonic Integrated Circuit Applications

Gibasiewicz, Krzysztof ; Kafar, Anna ; Schiavon, Dario ; Saba, Kiran ; Marona, Łucja ; Kamińska, Eliana ; Perlin, Piotr

Micromachines (Basel), 2023-02, Vol.14 (2), p.408 [Periódico revisado por pares]

Switzerland: MDPI AG

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18
Fabrication of Bulk Tungsten Microstructure Arrays for Hydrophobic Metallic Surfaces Using Inductively Coupled Plasma Deep Etching
Fabrication of Bulk Tungsten Microstructure Arrays for Hydrophobic Metallic Surfaces Using Inductively Coupled Plasma Deep Etching
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Fabrication of Bulk Tungsten Microstructure Arrays for Hydrophobic Metallic Surfaces Using Inductively Coupled Plasma Deep Etching

Wang, Zetian ; Xia, Yanming ; Song, Lu ; Chen, Jing ; Wang, Wei

Micromachines (Basel), 2024-06, Vol.15 (6), p.807 [Periódico revisado por pares]

Basel: MDPI AG

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19
Bio-Inspired Hierarchical Micro-/Nanostructures for Anti-Icing Solely Fabricated by Metal-Assisted Chemical Etching
Bio-Inspired Hierarchical Micro-/Nanostructures for Anti-Icing Solely Fabricated by Metal-Assisted Chemical Etching
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Bio-Inspired Hierarchical Micro-/Nanostructures for Anti-Icing Solely Fabricated by Metal-Assisted Chemical Etching

Zhang, Lansheng ; Chu, Xiaoyang ; Tian, Feng ; Xu, Yang ; Hu, Huan

Micromachines (Basel), 2022-07, Vol.13 (7), p.1077 [Periódico revisado por pares]

Switzerland: MDPI AG

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20
Effects of Mask Material on Lateral Undercut of Silicon Dry Etching
Effects of Mask Material on Lateral Undercut of Silicon Dry Etching
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Effects of Mask Material on Lateral Undercut of Silicon Dry Etching

Zhang, Yongkang ; Hou, Zhongxuan ; Si, Chaowei ; Han, Guowei ; Zhao, Yongmei ; Lu, Xiaorui ; Liu, Jiahui ; Ning, Jin ; Yang, Fuhua

Micromachines (Basel), 2023-01, Vol.14 (2), p.306 [Periódico revisado por pares]

Switzerland: MDPI AG

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