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Material Type: Artigo
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio MicrofabricationHuff, MichaelMicromachines (Basel), 2021-08, Vol.12 (8), p.991 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
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Material Type: Artigo
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Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP EtchingWu, Yu ; Dong, Xianshan ; Wang, Xuefang ; Xiao, Junfeng ; Sun, Quanquan ; Shen, Lifeng ; Lan, Jie ; Shen, Zhenfeng ; Xu, Jianfeng ; Du, YuqingyunMicromachines (Basel), 2024-04, Vol.15 (4), p.460 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
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Material Type: Artigo
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Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion EtchingBaracu, Angela M ; Dirdal, Christopher A ; Avram, Andrei M ; Dinescu, Adrian ; Muller, Raluca ; Jensen, Geir Uri ; Thrane, Paul Conrad Vaagen ; Angelskår, HallvardMicromachines (Basel), 2021-04, Vol.12 (5), p.501 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
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Material Type: Artigo
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The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser EtchingKim, Jonghyeok ; Kim, Byungjoo ; Choi, Jiyeon ; Ahn, SanghoonMicromachines (Basel), 2024-02, Vol.15 (3), p.320 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
5 |
Material Type: Artigo
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Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical EtchingKim, Jonghyeok ; Kim, Sungil ; Kim, Byungjoo ; Choi, Jiyeon ; Ahn, SanghoonMicromachines (Basel), 2023-09, Vol.14 (9), p.1766 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
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Material Type: Artigo
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An Endpoint Detection System for Ion Beam Etching Using Optical Emission SpectroscopyZhang, Junjie ; Luo, Jiahui ; Zou, Xudong ; Chen, JiaminMicromachines (Basel), 2022-02, Vol.13 (2), p.259 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
7 |
Material Type: Artigo
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The Method of Low-Temperature ICP Etching of InP/InGaAsP Heterostructures in Cl2-Based Plasma for Integrated Optics ApplicationsIshutkin, Sergey ; Arykov, Vadim ; Yunusov, Igor ; Stepanenko, Mikhail ; Smirnov, Vyacheslav ; Troyan, Pavel ; Zhidik, YuryMicromachines (Basel), 2021-12, Vol.12 (12), p.1535 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
8 |
Material Type: Artigo
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Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)Gerlt, Michael S. ; Läubli, Nino F. ; Manser, Michel ; Nelson, Bradley J. ; Dual, JürgMicromachines (Basel), 2021-05, Vol.12 (5), p.542 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
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Material Type: Artigo
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Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed NanoholesZhao, Yue ; Zhang, Kaiping ; Li, Hailiang ; Xie, ChangqingMicromachines (Basel), 2021-08, Vol.12 (8), p.931 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
10 |
Material Type: Artigo
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Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical EtchingKim, Tae ; Bae, Jee-Hwan ; Kim, Juyoung ; Cho, Min ; Kim, Yu-Chan ; Jin, Sungho ; Chun, DongwonMicromachines (Basel), 2020-07, Vol.11 (8), p.744 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |