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Material Type: Artigo
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Growth and Selective Etch of Phosphorus-Doped Silicon/Silicon–Germanium Multilayers Structures for Vertical Transistors ApplicationLi, Chen ; Lin, Hongxiao ; Li, Junjie ; Yin, Xiaogen ; Zhang, Yongkui ; Kong, Zhenzhen ; Wang, Guilei ; Zhu, Huilong ; Radamson, Henry H.Nanoscale research letters, 2020-12, Vol.15 (1), p.225-225, Article 225 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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Material Type: Artigo
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Fabrication of Ultralow‐Bevel Angle Mesa Structures for Vertical GaN DevicesTarenko, Jarosław ; Kamiński, Maciej ; Taube, Andrzej ; Ekielski, Marek ; Kruszka, Renata ; Zadura, Magdalena ; Szerling, Anna ; Prystawko, Paweł ; Boćkowski, Michał ; Król, Krystian ; Jankowska‐Śliwińska, Joanna ; Komorowska, Katarzyna ; Grzegory, IzabellaPhysica status solidi. A, Applications and materials science, 2024-04 [Periódico revisado por pares]Texto completo disponível |
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Material Type: Artigo
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Investigation of Field‐Effect Passivation Created by Hydrogen Plasma Etching of Radio Corporation of America Formed Chemical Oxides on Crystalline Silicon WafersJia, Haitian ; Tang, Muzhi ; Ge, JiaPhysica status solidi. A, Applications and materials science, 2021-01, Vol.218 (2), p.n/a [Periódico revisado por pares]Weinheim: Wiley Subscription Services, IncTexto completo disponível |
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Material Type: Artigo
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Influence of Fluence and Pulse Number on Laser Cleaning of Atmospheric‐Pressure‐Plasma‐Jet‐Etched Optical GlassesHeinke, Robert ; Arnold, Thomas ; Ehrhardt, Martin ; Lorenz, Pierre ; Zimmer, KlausPhysica status solidi. A, Applications and materials science, 2023-10 [Periódico revisado por pares]Texto completo disponível |
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Material Type: Artigo
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio MicrofabricationHuff, MichaelMicromachines (Basel), 2021-08, Vol.12 (8), p.991 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
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Material Type: Artigo
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Producing Silicon Carbide Micro and Nanostructures by Plasma‐Free Metal‐Assisted Chemical EtchingMichaels, Julian A. ; Janavicius, Lukas ; Wu, Xihang ; Chan, Clarence ; Huang, Hsieh‐Chih ; Namiki, Shunya ; Kim, Munho ; Sievers, Dane ; Li, XiulingAdvanced functional materials, 2021-08, Vol.31 (32), p.n/a [Periódico revisado por pares]Hoboken: Wiley Subscription Services, IncTexto completo disponível |
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Material Type: Artigo
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Complementary etching behavior of alkali, metal‐catalyzed chemical, and post‐etching of multicrystalline silicon wafersZou, Shuai ; Ye, Xiaoya ; Wu, Chengkun ; Cheng, Kexun ; Fang, Liang ; Tang, Rujun ; Shen, Mingrong ; Wang, Xusheng ; Su, XiaodongProgress in photovoltaics, 2019-06, Vol.27 (6), p.511-519 [Periódico revisado por pares]Bognor Regis: Wiley Subscription Services, IncTexto completo disponível |
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Material Type: Artigo
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Metal‐Assisted Chemical Etching of Silicon in Oxidizing HF Solutions: Origin, Mechanism, Development, and Black Silicon Solar Cell ApplicationHuo, Chenliang ; Wang, Jiang ; Fu, Haoxin ; Li, Xianlun ; Yang, Yi ; Wang, Hui ; Mateen, Abdul ; Farid, Ghulam ; Peng, Kui‐QingAdvanced functional materials, 2020-12, Vol.30 (52), p.n/a [Periódico revisado por pares]Hoboken: Wiley Subscription Services, IncTexto completo disponível |
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Material Type: Artigo
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Structuring of Si into Multiple Scales by Metal‐Assisted Chemical EtchingSrivastava, Ravi P. ; Khang, Dahl‐YoungAdvanced materials (Weinheim), 2021-11, Vol.33 (47), p.e2005932-n/a [Periódico revisado por pares]Germany: Wiley Subscription Services, IncTexto completo disponível |
10 |
Material Type: Artigo
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Hybrid Anodic and Metal‐Assisted Chemical Etching Method Enabling Fabrication of Silicon Carbide NanowiresChen, Yun ; Zhang, Cheng ; Li, Liyi ; Zhou, Shuang ; Chen, Xin ; Gao, Jian ; Zhao, Ni ; Wong, Ching‐PingSmall (Weinheim an der Bergstrasse, Germany), 2019-02, Vol.15 (7), p.e1803898-n/a [Periódico revisado por pares]Germany: Wiley Subscription Services, IncTexto completo disponível |