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Refinado por: Base de dados/Biblioteca: EZB Electronic Journals Library remover Nome da Publicação: Micromachines remover
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1
Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication

Huff, Michael

Micromachines (Basel), 2021-08, Vol.12 (8), p.991 [Periódico revisado por pares]

Basel: MDPI AG

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2
Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching
Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching
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Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching

Baracu, Angela M ; Dirdal, Christopher A ; Avram, Andrei M ; Dinescu, Adrian ; Muller, Raluca ; Jensen, Geir Uri ; Thrane, Paul Conrad Vaagen ; Angelskår, Hallvard

Micromachines (Basel), 2021-04, Vol.12 (5), p.501 [Periódico revisado por pares]

Switzerland: MDPI AG

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3
Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching
Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching
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Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching

Wu, Yu ; Dong, Xianshan ; Wang, Xuefang ; Xiao, Junfeng ; Sun, Quanquan ; Shen, Lifeng ; Lan, Jie ; Shen, Zhenfeng ; Xu, Jianfeng ; Du, Yuqingyun

Micromachines (Basel), 2024-04, Vol.15 (4), p.460 [Periódico revisado por pares]

Switzerland: MDPI AG

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4
The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching
The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching
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The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching

Kim, Jonghyeok ; Kim, Byungjoo ; Choi, Jiyeon ; Ahn, Sanghoon

Micromachines (Basel), 2024-02, Vol.15 (3), p.320 [Periódico revisado por pares]

Switzerland: MDPI AG

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5
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
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Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

Kim, Jonghyeok ; Kim, Sungil ; Kim, Byungjoo ; Choi, Jiyeon ; Ahn, Sanghoon

Micromachines (Basel), 2023-09, Vol.14 (9), p.1766 [Periódico revisado por pares]

Basel: MDPI AG

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6
An Endpoint Detection System for Ion Beam Etching Using Optical Emission Spectroscopy
An Endpoint Detection System for Ion Beam Etching Using Optical Emission Spectroscopy
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An Endpoint Detection System for Ion Beam Etching Using Optical Emission Spectroscopy

Zhang, Junjie ; Luo, Jiahui ; Zou, Xudong ; Chen, Jiamin

Micromachines (Basel), 2022-02, Vol.13 (2), p.259 [Periódico revisado por pares]

Switzerland: MDPI AG

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7
The Method of Low-Temperature ICP Etching of InP/InGaAsP Heterostructures in Cl2-Based Plasma for Integrated Optics Applications
The Method of Low-Temperature ICP Etching of InP/InGaAsP Heterostructures in Cl2-Based Plasma for Integrated Optics Applications
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The Method of Low-Temperature ICP Etching of InP/InGaAsP Heterostructures in Cl2-Based Plasma for Integrated Optics Applications

Ishutkin, Sergey ; Arykov, Vadim ; Yunusov, Igor ; Stepanenko, Mikhail ; Smirnov, Vyacheslav ; Troyan, Pavel ; Zhidik, Yury

Micromachines (Basel), 2021-12, Vol.12 (12), p.1535 [Periódico revisado por pares]

Basel: MDPI AG

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8
Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)
Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)
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Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

Gerlt, Michael S. ; Läubli, Nino F. ; Manser, Michel ; Nelson, Bradley J. ; Dual, Jürg

Micromachines (Basel), 2021-05, Vol.12 (5), p.542 [Periódico revisado por pares]

Basel: MDPI AG

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9
Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed Nanoholes
Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed Nanoholes
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Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed Nanoholes

Zhao, Yue ; Zhang, Kaiping ; Li, Hailiang ; Xie, Changqing

Micromachines (Basel), 2021-08, Vol.12 (8), p.931 [Periódico revisado por pares]

Basel: MDPI AG

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10
Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching
Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching
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Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching

Kim, Tae ; Bae, Jee-Hwan ; Kim, Juyoung ; Cho, Min ; Kim, Yu-Chan ; Jin, Sungho ; Chun, Dongwon

Micromachines (Basel), 2020-07, Vol.11 (8), p.744 [Periódico revisado por pares]

Basel: MDPI AG

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