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Refinado por: Nome da Publicação: Micromachines remover assunto: Physics remover
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1
Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication

Huff, Michael

Micromachines (Basel), 2021-08, Vol.12 (8), p.991 [Periódico revisado por pares]

Basel: MDPI AG

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2
Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching
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Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching

Wu, Yu ; Dong, Xianshan ; Wang, Xuefang ; Xiao, Junfeng ; Sun, Quanquan ; Shen, Lifeng ; Lan, Jie ; Shen, Zhenfeng ; Xu, Jianfeng ; Du, Yuqingyun

Micromachines (Basel), 2024-04, Vol.15 (4), p.460 [Periódico revisado por pares]

Switzerland: MDPI AG

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3
Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching
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Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching

Baracu, Angela M ; Dirdal, Christopher A ; Avram, Andrei M ; Dinescu, Adrian ; Muller, Raluca ; Jensen, Geir Uri ; Thrane, Paul Conrad Vaagen ; Angelskår, Hallvard

Micromachines (Basel), 2021-04, Vol.12 (5), p.501 [Periódico revisado por pares]

Switzerland: MDPI AG

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4
The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching
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The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching

Kim, Jonghyeok ; Kim, Byungjoo ; Choi, Jiyeon ; Ahn, Sanghoon

Micromachines (Basel), 2024-02, Vol.15 (3), p.320 [Periódico revisado por pares]

Switzerland: MDPI AG

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5
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
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Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

Kim, Jonghyeok ; Kim, Sungil ; Kim, Byungjoo ; Choi, Jiyeon ; Ahn, Sanghoon

Micromachines (Basel), 2023-09, Vol.14 (9), p.1766 [Periódico revisado por pares]

Basel: MDPI AG

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6
Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)
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Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE)

Gerlt, Michael S. ; Läubli, Nino F. ; Manser, Michel ; Nelson, Bradley J. ; Dual, Jürg

Micromachines (Basel), 2021-05, Vol.12 (5), p.542 [Periódico revisado por pares]

Basel: MDPI AG

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7
Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed Nanoholes
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Fabrication and Characterization of Inverted Silicon Pyramidal Arrays with Randomly Distributed Nanoholes

Zhao, Yue ; Zhang, Kaiping ; Li, Hailiang ; Xie, Changqing

Micromachines (Basel), 2021-08, Vol.12 (8), p.931 [Periódico revisado por pares]

Basel: MDPI AG

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8
Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching
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Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching

Kim, Tae ; Bae, Jee-Hwan ; Kim, Juyoung ; Cho, Min ; Kim, Yu-Chan ; Jin, Sungho ; Chun, Dongwon

Micromachines (Basel), 2020-07, Vol.11 (8), p.744 [Periódico revisado por pares]

Basel: MDPI AG

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9
On reactive Ion Etching of Parylene-C with Simple Photoresist Mask for Fabrication of High Porosity Membranes to Capture Circulating and Exfoliated Tumor Cells
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On reactive Ion Etching of Parylene-C with Simple Photoresist Mask for Fabrication of High Porosity Membranes to Capture Circulating and Exfoliated Tumor Cells

Rabadi, Inad ; Carpentieri, David ; Wang, Jue ; Zenhausern, Frederic ; Gu, Jian

Micromachines (Basel), 2024-04, Vol.15 (4), p.521 [Periódico revisado por pares]

Switzerland: MDPI AG

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10
Improving Performance and Breakdown Voltage in Normally-Off GaN Recessed Gate MIS-HEMTs Using Atomic Layer Etching and Gate Field Plate for High-Power Device Applications
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Improving Performance and Breakdown Voltage in Normally-Off GaN Recessed Gate MIS-HEMTs Using Atomic Layer Etching and Gate Field Plate for High-Power Device Applications

Liu, An-Chen ; Tu, Po-Tsung ; Chen, Hsin-Chu ; Lai, Yung-Yu ; Yeh, Po-Chun ; Kuo, Hao-Chung

Micromachines (Basel), 2023-08, Vol.14 (8), p.1582 [Periódico revisado por pares]

Basel: MDPI AG

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Assunto 

  1. Etching  (330)
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