Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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On Component Reliability and System Reliability for Space MissionsYuan Chen ; Gillespie, A. M. ; Monaghan, M. W. ; Sampson, M. J. ; Hodson, R. F.2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.4B.2.1-4B.2.8IEEETexto completo disponível |
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2 |
Material Type: Ata de Congresso
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Secure computations in minimal model using simple ESCT decompositionSampson, M. ; Voudouris, D. ; Papakonstantinou, G.2008 16th International Conference on Software, Telecommunications and Computer Networks, 2008, p.380-383IEEETexto completo disponível |
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3 |
Material Type: Ata de Congresso
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A Quantum Algorithm for Finding Minimum Exclusive-Or ExpressionsSampson, M. ; Voudouris, D. ; Papakonstantinou, G.IEEE Computer Society Annual Symposium on VLSI (ISVLSI '07), 2007, p.416-421IEEETexto completo disponível |
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4 |
Material Type: Ata de Congresso
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e-Prolipsis: A web based risk estimation platform to support and register breast cancer diagnosis in GreeceDimopoulos, A. C. ; Lakoumentas, J. ; Antaraki, A. ; Frigas, A. ; Ikonomakis, E. K. ; Sampson, M. ; Tagaris, A. ; Liakou, A. ; Athanasiadis, E. ; Spyrou, G. ; Ligomenides, P.2012 IEEE 12th International Conference on Bioinformatics & Bioengineering (BIBE), 2012, p.434-438IEEETexto completo disponível |
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Material Type: Ata de Congresso
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Scanning Electron Microscopy of Superovulated Mouse Ovaries Exposed to Spatial Peak Intensity Ultrasound at 5 Watts for 5 MinutesSampson, M.B. ; Carnes, K.IEEE 1986 Ultrasonics Symposium, 1986, p.993-996IEEESem texto completo |
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6 |
Material Type: Ata de Congresso
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Managing distributed UPS energy for effective power capping in data centersKontorinis, V. ; Zhang, L. E. ; Aksanli, B. ; Sampson, J. ; Homayoun, H. ; Pettis, E. ; Tullsen, D. M. ; Simunic Rosing, T.2012 39th Annual International Symposium on Computer Architecture (ISCA), 2012, p.488-499IEEETexto completo disponível |
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7 |
Material Type: Ata de Congresso
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A 10nm platform technology for low power and high performance application featuring FINFET devices with multi workfunction gate stack on bulk and SOISeo, K.-I ; Haran, B. ; Gupta, D. ; Guo, D. ; Standaert, T. ; Xie, R. ; Shang, H. ; Alptekin, E. ; Bae, D.-I ; Bae, G. ; Boye, C. ; Cai, H. ; Chanemougame, D. ; Chao, R. ; Cheng, K. ; Cho, J. ; Choi, K. ; Hamieh, B. ; Hong, J. G. ; Hook, T. ; Jang, L. ; Jung, J. ; Jung, R. ; Lee, D. ; Lherron, B. ; Kambhampati, R. ; Kim, B. ; Kim, H. ; Kim, K. ; Kim, T. S. ; Ko, S.-B ; Lie, F. L. ; Liu, D. ; Mallela, H. ; Mclellan, E. ; Mehta, S. ; Montanini, P. ; Mottura, M. ; Nam, J. ; Nam, S. ; Nelson, F. ; Ok, I. ; Park, C. ; Park, Y. ; Paul, A. ; Prindle, C. ; Ramachandran, R. ; Sankarapandian, M. ; Sardesai, V. ; Scholze, A. ; Seo, S.-C ; Shearer, J. ; Southwick, R. ; Sreenivasan, R. ; Stieg, S. ; Strane, J. ; Sun, X. ; Sung, M. G. ; Surisetty, C. ; Tsutsui, G. ; Tripathi, N. ; Vega, R. ; Waskiewicz, C. ; Weybright, M. ; Yeh, C.-C ; Bu, H. ; Burns, S. ; Canaperi, D. ; Celik, M. ; Colburn, M. ; Jagannathan, H. ; Kanakasabaphthy, S. ; Kleemeier, W. ; Liebmann, L. ; Mcherron, D. ; Oldiges, P. ; Paruchuri, V. ; Spooner, T. ; Stathis, J. ; Divakaruni, R. ; Gow, T. ; Iacoponi, J. ; Jenq, J. ; Sampson, R. ; Khare, M.2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014, p.1-2IEEESem texto completo |
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8 |
Material Type: Ata de Congresso
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Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyondLiu, Q ; Yagishita, A ; Loubet, N ; Khakifirooz, A ; Kulkarni, P ; Yamamoto, T ; Cheng, K ; Fujiwara, M ; Cai, J ; Dorman, D ; Mehta, S ; Khare, P ; Yako, K ; Zhu, Y ; Mignot, S ; Kanakasabapathy, S ; Monfray, S ; Boeuf, F ; Koburger, C ; Sunamura, H ; Ponoth, S ; Reznicek, A ; Haran, B ; Upham, A ; Johnson, R ; Edge, L F ; Kuss, J ; Levin, T ; Berliner, N ; Leobandung, E ; Skotnicki, T ; Hane, M ; Bu, H ; Ishimaru, K ; Kleemeier, W ; Takayanagi, M ; Doris, B ; Sampson, R2010 Symposium on VLSI Technology, 2010, p.61-62IEEETexto completo disponível |
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9 |
Material Type: Ata de Congresso
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UTBB FDSOI scaling enablers for the 10nm nodeGrenouillet, L. ; Liu, Q. ; Wacquez, R. ; Morin, P. ; Loubet, N. ; Cooper, D. ; Pofelski, A. ; Weng, W. ; Bauman, F. ; Gribelyuk, M. ; Wang, Y. ; De Salvo, B. ; Gimbert, J. ; Cheng, K. ; Le Tiec, Y. ; Chanemougame, D. ; Augendre, E. ; Maitrejean, S. ; Khakifirooz, A. ; Kuss, J. ; Schulz, R. ; Janicki, C. ; Lherron, B. ; Guillaumet, S. ; Rozeau, O. ; Chafik, F. ; Bataillon, J. L. ; Wu, T. ; Kleemeier, W. ; Celik, M. ; Faynot, O. ; Sampson, R. ; Doris, B. ; Vinet, M.2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2013, p.1-2 [Periódico revisado por pares]IEEESem texto completo |
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10 |
Material Type: Ata de Congresso
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Stochastic Functional Verification of DNN Design through Progressive Virtual Dataset GenerationJinhang Choi ; Irick, Kevin M. ; Hardin, Justin ; Weichao Qiu ; Yuille, Alan ; Sampson, Jack ; Narayanan, Vijaykrishnan2018 IEEE International Symposium on Circuits and Systems (ISCAS), 2018, p.1-5IEEESem texto completo |