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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
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Low-temperature sintering with nano-silver paste in die-attached interconnectionTAO WANG ; XU CHEN ; LU, Guo-Quan ; LEI, Guang-YinJournal of electronic materials, 2007-10, Vol.36 (10), p.1333-1340 [Periódico revisado por pares]New York, NY: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 2 |
Material Type: Artigo
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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?Siow, Kim S.Journal of electronic materials, 2014-04, Vol.43 (4), p.947-961 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 3 |
Material Type: Artigo
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review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applicationsLin, Y. C ; Zhong, JueJournal of materials science, 2008-05, Vol.43 (9), p.3072-3093 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 4 |
Material Type: Artigo
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Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder JointYoon, Jeong-Won ; Noh, Bo-In ; Jung, Seung-BooJournal of electronic materials, 2011-09, Vol.40 (9), p.1950-1955 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 5 |
Material Type: Artigo
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Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion BondingLiu, H. ; Wang, K. ; Aasmundtveit, K.E. ; Hoivik, N.Journal of electronic materials, 2012-09, Vol.41 (9), p.2453-2462 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 6 |
Material Type: Artigo
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Behavior of Stone Columns Based on Experimental and FEM AnalysisAmbily, A. P ; Gandhi, Shailesh RJournal of geotechnical and geoenvironmental engineering, 2007-04, Vol.133 (4), p.405-415 [Periódico revisado por pares]New York, NY: American Society of Civil EngineersTexto completo disponível |
| 7 |
Material Type: Artigo
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Effect of replacement of MgO by CaO on sintering, crystallization and properties of MgO–Al2O3–SiO2 system glass-ceramicsChen, Guo-HuaJournal of materials science, 2007-09, Vol.42 (17), p.7239-7244 [Periódico revisado por pares]Heidelberg: Kluwer Academic Publishers-Plenum PublishersTexto completo disponível |
| 8 |
Material Type: Artigo
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Environmentally friendly polymer hybrids: Part I Mechanical, thermal, and barrier properties of thermoplastic starch/clay nanocompositesPARK, Hwan-Man ; LEE, Won-Ki ; PARK, Chan-Young ; CHO, Won-Jei ; HA, Chang-SikJournal of materials science, 2003-03, Vol.38 (5), p.909-915 [Periódico revisado por pares]Heidelberg: SpringerTexto completo disponível |
| 9 |
Material Type: Artigo
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Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand ModelChang, Rui Wu ; McCluskey, F. PatrickJournal of electronic materials, 2009-09, Vol.38 (9), p.1855-1859 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 10 |
Material Type: Artigo
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Development of Flexible Micro-Thermo-electrochemical Generators Based on Ionic LiquidsUhl, Stefanie ; Laux, Edith ; Journot, Tony ; Jeandupeux, Laure ; Charmet, Jérôme ; Keppner, HerbertJournal of electronic materials, 2014-10, Vol.43 (10), p.3758-3764 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
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