Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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Material Type: Artigo
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3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-ViasKnickerbocker, J.U. ; Patel, C.S. ; Andry, P.S. ; Tsang, C.K. ; Buchwalter, L.P. ; Sprogis, E.J. ; Hua Gan ; Horton, R.R. ; Polastre, R.J. ; Wright, S.L. ; Cotte, J.M.IEEE journal of solid-state circuits, 2006-08, Vol.41 (8), p.1718-1725 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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A chip-scale packaging technology for 60-GHz wireless chipsetsPfeiffer, U.R. ; Grzyb, J. ; Duixian Liu ; Gaucher, B. ; Beukema, T. ; Floyd, B.A. ; Reynolds, S.K.IEEE transactions on microwave theory and techniques, 2006-08, Vol.54 (8), p.3387-3397 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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Toward the Next Level of PCB Usage in Power Electronic Convertersde Jong, E.C.W. ; Ferreira, B.J.A. ; Bauer, P.IEEE transactions on power electronics, 2008-11, Vol.23 (6), p.3151-3163 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal ProsthesesWen Li ; Rodger, Damien C ; Meng, Ellis ; Weiland, James D ; Humayun, Mark S ; Yu-Chong TaiJournal of microelectromechanical systems, 2010-08, Vol.19 (4), p.735-742 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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Packaging a W -Band Integrated Module With an Optimized Flip-Chip Interconnect on an Organic SubstrateKhan, Wasif Tanveer ; Lopez, Aida L. Vera ; Ulusoy, A. Cagri ; Papapolymerou, JohnIEEE transactions on microwave theory and techniques, 2014-01, Vol.62 (1), p.64-72 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging InductorsAHN, Youngkook ; NAM, Hyunseok ; ROH, JeongjinIEEE transactions on power electronics, 2012-10, Vol.27 (10), p.4347-4356 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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Substrate Integrated Evanescent-Mode Cavity Filter With a 3.5 to 1 Tuning RatioSungwook Moon ; Sigmarsson, H H ; Joshi, Himanshu ; Chappell, W JIEEE microwave and wireless components letters, 2010-08, Vol.20 (8), p.450-452 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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A High-Linearity X-Band Four-Element Phased-Array Receiver: CMOS Chip and PackagingDonghyup Shin ; Rebeiz, G. M.IEEE transactions on microwave theory and techniques, 2011-08, Vol.59 (8), p.2064-2072 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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Material Type: Artigo
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HDTV1080p H.264/AVC Encoder Chip Design and Performance AnalysisZhenyu Liu ; Yang Song ; Ming Shao ; Shen Li ; Lingfeng Li ; Ishiwata, S. ; Nakagawa, M. ; Goto, S. ; Ikenaga, T.IEEE journal of solid-state circuits, 2009-02, Vol.44 (2), p.594-608 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
10 |
Material Type: Artigo
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Optical I/O Technology for Tera-Scale ComputingYoung, I.A. ; Mohammed, E. ; Liao, J.T.S. ; Kern, A.M. ; Palermo, S. ; Block, B.A. ; Reshotko, M.R. ; Chang, P.L.D.IEEE journal of solid-state circuits, 2010-01, Vol.45 (1), p.235-248 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |