Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Aging of plasma-activated copper and gold surfaces and its hydrophilic recovery after water immersionPrysiazhnyi, Vadym ; Slavicek, Pavel ; Cernak, MirkoThin solid films, 2014-01, Vol.550, p.373-380 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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2 |
Material Type: Artigo
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Rapid plasma treatment of polyimide for improved adhesive and durable copper film depositionUsami, Kenji ; Ishijima, Tatsuo ; Toyoda, HirotakaThin solid films, 2012-10, Vol.521, p.22-26 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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3 |
Material Type: Artigo
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High-rate reduction of copper oxide using atmospheric-pressure inductively coupled plasma microjetsTajima, Satomi ; Tsuchiya, Shouichi ; Matsumori, Masashi ; Nakatsuka, Shigeki ; Ichiki, TakanoriThin solid films, 2011-08, Vol.519 (20), p.6773-6777 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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4 |
Material Type: Artigo
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A comparison of reactive plasma pre-treatments on PET substrates by Cu and Ti pulsed-DC and HIPIMS dischargesAudronis, M. ; Hinder, S.J. ; Mack, P. ; Bellido-Gonzalez, V. ; Bussey, D. ; Matthews, A. ; Baker, M.A.Thin solid films, 2011-12, Vol.520 (5), p.1564-1570 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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5 |
Material Type: Artigo
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Rapid and highly efficient growth of graphene on copper by chemical vapor deposition of ethanolLisi, Nicola ; Buonocore, Francesco ; Dikonimos, Theodoros ; Leoni, Enrico ; Faggio, Giuliana ; Messina, Giacomo ; Morandi, Vittorio ; Ortolani, Luca ; Capasso, AndreaThin solid films, 2014-11, Vol.571, p.139-144 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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6 |
Material Type: Artigo
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Adhesion of sputter-deposited Cu/Ti film on plasma-treated polymer substrateOh, Yoong ; Kim, Eun Jeong ; Kim, Yongdeok ; Choi, Kwangseok ; Han, Won Bae ; Kim, Hee-Soo ; Yoon, Chong SeungThin solid films, 2016-02, Vol.600, p.90-97 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
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7 |
Material Type: Artigo
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The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnectMun, Ki-Yeung ; Hong, Tae Eun ; Cheon, Taehoon ; Jang, Yujin ; Lim, Byoung-Yong ; Kim, Sunjung ; Kim, Soo-HyunThin solid films, 2014-07, Vol.562, p.118-125 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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8 |
Material Type: Artigo
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CIGS thin films, solar cells, and submodules fabricated using a rf-plasma cracked Se-radical beam sourceIshizuka, Shogo ; Yamada, Akimasa ; Shibata, Hajime ; Fons, Paul ; Niki, ShigeruThin solid films, 2011-08, Vol.519 (21), p.7216-7220 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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9 |
Material Type: Artigo
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Formation of cuprous oxide films via oxygen plasmaOoi, Chinchun ; Goh, Gregory K.L.Thin solid films, 2010-10, Vol.518 (24), p.e98-e100 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
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10 |
Material Type: Artigo
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Study on chemical vapor deposited copper films on cyano and carboxylic self-assembled monolayer diffusion barriersKong, Zhe ; Wang, Qi ; Ding, Liang ; Wu, TaoThin solid films, 2010-06, Vol.518 (17), p.4852-4859 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |