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1
A comparative study on detection of bartonella henselae infection by culture followed by pcr, nested-pcr and ifa
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A comparative study on detection of bartonella henselae infection by culture followed by pcr, nested-pcr and ifa

DIREN SIGIRCI B ; CELIK B ; BASARAN KAHRAMAN B ; GUMUS B ; METINER K ; ADIGUZEL MC ; IKIZ S ; BAGCIGIL AF ; OZGUR NY ; AK S

Veteriner fakultesi dergisi, 2017-03, Vol.23 (2), p.333-337 [Periódico revisado por pares]

Kafkas University, Faculty of Veterinary Medicine

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2
A computational damage mechanics model for thermomigration
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A computational damage mechanics model for thermomigration

Li, Shidong ; Basaran, Cemal

Mechanics of materials, 2009-03, Vol.41 (3), p.271-278 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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3
Advancing electronic packaging, one solder joint at a time
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Advancing electronic packaging, one solder joint at a time

R & D, 2003-10, Vol.45 (10), p.10

Cleveland: Advantage Business Media

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4
An accelerated algorithm for full band electron–phonon scattering rate computation
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An accelerated algorithm for full band electron–phonon scattering rate computation

Chu, Yanbiao ; Gautreau, Pierre ; Ragab, Tarek ; Basaran, Cemal

Computer physics communications, 2014-12, Vol.185 (12), p.3392-3397 [Periódico revisado por pares]

Elsevier B.V

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5
An analytical model for thermal stress analysis of multi-layered microelectronic packaging
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An analytical model for thermal stress analysis of multi-layered microelectronic packaging

Wen, Yujun ; Basaran, Cemal

Mechanics of materials, 2004-04, Vol.36 (4), p.369-385 [Periódico revisado por pares]

Lausanne: Elsevier Ltd

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6
Analysis of multi-layered microelectronic packaging under uniformly distributed loading
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Analysis of multi-layered microelectronic packaging under uniformly distributed loading

Wen, Yujun ; Basaran, Cemal

International journal of solids and structures, 2003-06, Vol.40 (13), p.3331-3345 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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7
Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading
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Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading

Basaran, C. ; Wen, Y.

IEEE transactions on components and packaging technologies, 2006-12, Vol.29 (4), p.850-855 [Periódico revisado por pares]

New York: IEEE

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8
Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties
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Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties

Zhang, Ji ; Osloub, Ehsan ; Siddiqui, Fatima ; Zhang, Weixiang ; Ragab, Tarek ; Basaran, Cemal

Materials, 2019-05, Vol.12 (9), p.1425 [Periódico revisado por pares]

Switzerland: MDPI AG

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9
Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages
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Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages

Liu, Heng ; Basaran, C ; Cartwright, A N ; Casey, W

IEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.217-223 [Periódico revisado por pares]

New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)

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10
Application of wavelet filtering techniques to Lau interferometric fringe analysis for measurement of small tilt angles
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Application of wavelet filtering techniques to Lau interferometric fringe analysis for measurement of small tilt angles

Singh, Sumitra ; Rana, Santosh ; Prakash, Shashi ; Sasaki, Osami

Optik (Stuttgart), 2011-09, Vol.122 (18), p.1666-1671 [Periódico revisado por pares]

Elsevier GmbH

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