Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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A comparative study on detection of bartonella henselae infection by culture followed by pcr, nested-pcr and ifaDIREN SIGIRCI B ; CELIK B ; BASARAN KAHRAMAN B ; GUMUS B ; METINER K ; ADIGUZEL MC ; IKIZ S ; BAGCIGIL AF ; OZGUR NY ; AK SVeteriner fakultesi dergisi, 2017-03, Vol.23 (2), p.333-337 [Periódico revisado por pares]Kafkas University, Faculty of Veterinary MedicineTexto completo disponível |
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Material Type: Artigo
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A computational damage mechanics model for thermomigrationLi, Shidong ; Basaran, CemalMechanics of materials, 2009-03, Vol.41 (3), p.271-278 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
3 |
Material Type: Artigo
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Advancing electronic packaging, one solder joint at a timeR & D, 2003-10, Vol.45 (10), p.10Cleveland: Advantage Business MediaTexto completo disponível |
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Material Type: Artigo
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An accelerated algorithm for full band electron–phonon scattering rate computationChu, Yanbiao ; Gautreau, Pierre ; Ragab, Tarek ; Basaran, CemalComputer physics communications, 2014-12, Vol.185 (12), p.3392-3397 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
5 |
Material Type: Artigo
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An analytical model for thermal stress analysis of multi-layered microelectronic packagingWen, Yujun ; Basaran, CemalMechanics of materials, 2004-04, Vol.36 (4), p.369-385 [Periódico revisado por pares]Lausanne: Elsevier LtdTexto completo disponível |
6 |
Material Type: Artigo
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Analysis of multi-layered microelectronic packaging under uniformly distributed loadingWen, Yujun ; Basaran, CemalInternational journal of solids and structures, 2003-06, Vol.40 (13), p.3331-3345 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
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Material Type: Artigo
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Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient LoadingBasaran, C. ; Wen, Y.IEEE transactions on components and packaging technologies, 2006-12, Vol.29 (4), p.850-855 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Anisotropy of Graphene Nanoflake Diamond Interface Frictional PropertiesZhang, Ji ; Osloub, Ehsan ; Siddiqui, Fatima ; Zhang, Weixiang ; Ragab, Tarek ; Basaran, CemalMaterials, 2019-05, Vol.12 (9), p.1425 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
9 |
Material Type: Artigo
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Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA PackagesLiu, Heng ; Basaran, C ; Cartwright, A N ; Casey, WIEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.217-223 [Periódico revisado por pares]New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)Texto completo disponível |
10 |
Material Type: Artigo
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Application of wavelet filtering techniques to Lau interferometric fringe analysis for measurement of small tilt anglesSingh, Sumitra ; Rana, Santosh ; Prakash, Shashi ; Sasaki, OsamiOptik (Stuttgart), 2011-09, Vol.122 (18), p.1666-1671 [Periódico revisado por pares]Elsevier GmbHTexto completo disponível |