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Creep rupture life prediction of short fiber-reinforced metal matrix composites
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Creep rupture life prediction of short fiber-reinforced metal matrix composites

NAM, H. W ; HAN, K. S

Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science, 1998-07, Vol.29 (7), p.1983-1989 [Periódico revisado por pares]

New York, NY: Springer

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A novel B19′ martensite in nickel titanium shape memory alloys
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A novel B19′ martensite in nickel titanium shape memory alloys

Krishnan, Madangopal ; Singh, J.B.

Acta materialia, 2000-04, Vol.48 (6), p.1325-1344 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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3
Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging
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Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging

Hsiao, Li-Yin ; Duh, Jenq-Gong Bailey, Christopher

Soldering & surface mount technology, 2006-04, Vol.18 (2), p.18-26 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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4
Specimen-geometry effects on mechanical behavior of metallic glasses
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Specimen-geometry effects on mechanical behavior of metallic glasses

Liu, F.X. ; Liaw, P.K. ; Wang, G.Y. ; Chiang, C.L. ; Smith, D.A. ; Rack, P.D. ; Chu, J.P. ; Buchanan, R.A.

Intermetallics, 2006-08, Vol.14 (8), p.1014-1018 [Periódico revisado por pares]

Elsevier Ltd

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5
Conductive Core-Sheath Nanofibers and Their Potential Application in Neural Tissue Engineering
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Conductive Core-Sheath Nanofibers and Their Potential Application in Neural Tissue Engineering

Xie, Jingwei ; MacEwan, Matthew R. ; Willerth, Stephanie M. ; Li, Xiaoran ; Moran, Daniel W. ; Sakiyama-Elbert, Shelly E. ; Xia, Younan

Advanced functional materials, 2009-07, Vol.19 (14), p.2312-2318 [Periódico revisado por pares]

Weinheim: WILEY-VCH Verlag

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6
On adsorption of aluminium and methyl groups on silica for TMA/H2O process in atomic layer deposition of aluminium oxide nano layers
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On adsorption of aluminium and methyl groups on silica for TMA/H2O process in atomic layer deposition of aluminium oxide nano layers

Philip, Anu ; Rajeev Kumar, K.

Bulletin of materials science, 2010-04, Vol.33 (2), p.97-102 [Periódico revisado por pares]

India: Springer-Verlag

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7
A review of stencil printing for microelectronic packaging
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A review of stencil printing for microelectronic packaging

Kay, Robert ; Desmulliez, Marc

Soldering & surface mount technology, 2012-01, Vol.24 (1), p.38-50 [Periódico revisado por pares]

Bradford: Emerald Group Publishing Limited

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8
Hydrophobic surfaces for control and enhancement of water phase transitions
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Hydrophobic surfaces for control and enhancement of water phase transitions

Alizadeh, Azar ; Bahadur, Vaibhav ; Kulkarni, Ambarish ; Yamada, Masako ; Ruud, James A.

MRS bulletin, 2013-05, Vol.38 (5), p.407-411 [Periódico revisado por pares]

New York, USA: Cambridge University Press

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9
Dendritic silver nanostructures obtained via one-step electrosynthesis: effect of nonanesulfonic acid and polyvinylpyrrolidone as additives on the analytical performance for hydrogen peroxide sensing
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Dendritic silver nanostructures obtained via one-step electrosynthesis: effect of nonanesulfonic acid and polyvinylpyrrolidone as additives on the analytical performance for hydrogen peroxide sensing

Guadagnini, Lorella ; Ballarin, Barbara ; Tonelli, Domenica

Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology, 2013-10, Vol.15 (10), p.1-11, Article 1971

Dordrecht: Springer Netherlands

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10
Design of a Novel Down-Hole Pump with Hydro-Automatic Reversing Valve
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Design of a Novel Down-Hole Pump with Hydro-Automatic Reversing Valve

Zhao, Wei ; Guo, Chu Wen

Applied Mechanics and Materials, 2013-10, Vol.456, p.120-124 [Periódico revisado por pares]

Zurich: Trans Tech Publications Ltd

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