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A thermodynamic model for electrical current induced damage
A thermodynamic model for electrical current induced damage
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A thermodynamic model for electrical current induced damage

Basaran, Cemal ; Lin, Minghui ; Ye, Hua

International journal of solids and structures, 2003-12, Vol.40 (26), p.7315-7327 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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2
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
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A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects

Gomez, Juan ; Basaran, Cemal

International journal of solids and structures, 2005-06, Vol.42 (13), p.3744-3772 [Periódico revisado por pares]

Elsevier Ltd

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3
An Irreversible Thermodynamics Theory for Damage Mechanics of Solids
An Irreversible Thermodynamics Theory for Damage Mechanics of Solids
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An Irreversible Thermodynamics Theory for Damage Mechanics of Solids

Basaran, Cemal ; Nie, Shihua

International journal of damage mechanics, 2004-07, Vol.13 (3), p.205-223 [Periódico revisado por pares]

Thousand Oaks, CA: SAGE Publications

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4
Closed form vs. finite element analysis of laminated stacks
Closed form vs. finite element analysis of laminated stacks
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Closed form vs. finite element analysis of laminated stacks

Basaran, Cemal ; Zhao, Ying

Finite elements in analysis and design, 1999-06, Vol.32 (3), p.163-179 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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5
Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons
Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons
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Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons

Zhang, Ji ; Ragab, Tarek ; Basaran, Cemal

International journal of damage mechanics, 2019-03, Vol.28 (3), p.325-345 [Periódico revisado por pares]

London, England: SAGE Publications

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6
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
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Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm

Gomez, Juan ; Basaran, Cemal

Mechanics of materials, 2006-07, Vol.38 (7), p.585-598 [Periódico revisado por pares]

Lausanne: Elsevier Ltd

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7
Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging
Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging
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Damage Mechanics Modeling of Concurrent Thermal and Vibration Loading on Electronics Packaging

Gomez, Juan ; Lin, Minghui ; Basaran, Cemal

Multidiscipline modeling in materials and structures, 2006-03, Vol.2 (3), p.309-326 [Periódico revisado por pares]

Bingley: Emerald Group Publishing Limited

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8
Damage mechanics of electromigration induced failure
Damage mechanics of electromigration induced failure
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Damage mechanics of electromigration induced failure

Basaran, Cemal ; Lin, Minghui

Mechanics of materials, 2008, Vol.40 (1), p.66-79 [Periódico revisado por pares]

Lausanne: Elsevier Ltd

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9
Damage Mechanics of Low Temperature Electromigration and Thermomigration
Damage Mechanics of Low Temperature Electromigration and Thermomigration
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Damage Mechanics of Low Temperature Electromigration and Thermomigration

Shidong Li ; Abdulhamid, M.F. ; Basaran, C.

IEEE transactions on advanced packaging, 2009-05, Vol.32 (2), p.478-485

New York: IEEE

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10
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses
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Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas C.

International journal of damage mechanics, 2006-01, Vol.15 (1), p.41-67 [Periódico revisado por pares]

Thousand Oaks, CA: SAGE Publications

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