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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
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1/f Noise in HgCdTe Focal-Plane ArraysKinch, M.A. ; Strong, R.L. ; Schaake, C.A.Journal of electronic materials, 2013-11, Vol.42 (11), p.3243-3251 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 2 |
Material Type: Artigo
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2D porous nanosheets of Y-doped ZnO for dielectric and ferroelectric applicationsGoel, Sahil ; Sinha, Nidhi ; Yadav, Harsh ; Joseph, Abhilash J. ; Kumar, BinayJournal of materials science. Materials in electronics, 2018-08, Vol.29 (16), p.13818-13832 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 3 |
Material Type: Artigo
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3,5-dichlorobenzylamine lead high-performance and stable 2D/3D perovskite solar cellsLi, Ji ; Xiang, Peng ; Tan, Xinyu ; Li, Bowen ; Zhang, Kai ; Zhu, Ying ; Ren, Yanqi ; Chen, XiaoboJournal of materials science. Materials in electronics, 2023-03, Vol.34 (9), p.794, Article 794 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 4 |
Material Type: Artigo
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3D BiOBr/BiOCl heterostructure microspheres with enhanced photocatalytic activityZhao, Chenhui ; Liang, Ying ; Li, Wei ; Chen, Xin ; Tian, Yi ; Yin, Dezhong ; Zhang, QiuyuJournal of materials science. Materials in electronics, 2020-02, Vol.31 (3), p.1868-1878 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 5 |
Material Type: Artigo
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3D Burr-like Pt nanoparticles as co-catalyst decorated on TiO2 nanotubes: an effective hydrogen production photoanode with enhanced photoelectrochemical performanceWang, Kehan ; Yu, Ruimin ; Wang, Lei ; Guan, Shuxia ; Ji, LeiJournal of materials science. Materials in electronics, 2021-05, Vol.32 (9), p.11737-11750 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 6 |
Material Type: Artigo
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3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin ParametersBelhenini, Soufyane ; Tougui, Abdellah ; Bouchou, Abdelhake ; Mohan, Ranganathan ; Dosseul, FranckJournal of electronic materials, 2014-03, Vol.43 (3), p.708-716 [Periódico revisado por pares]Boston: Springer USTexto completo disponível |
| 7 |
Material Type: Artigo
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3D graphene-Ni microspheres with excellent microwave absorption and corrosion resistance propertiesZeng, Qiang ; Xu, Dong-wei ; Chen, Ping ; Yu, Qi ; Xiong, Xu-hai ; Chu, Hai-rong ; Wang, QiJournal of materials science. Materials in electronics, 2018-02, Vol.29 (3), p.2421-2433 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 8 |
Material Type: Artigo
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3D hierarchical NiCo2S4/Ni–Co LDH architecture for high-performance supercapacitorZhou, Zihao ; Tie, Jinjin ; Yang, Hua ; Cheng, Gao ; Sun, Ming ; Yu, LinJournal of materials science. Materials in electronics, 2021-02, Vol.32 (3), p.3843-3853 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 9 |
Material Type: Artigo
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3D-interconnected framework binary composite based on polypyrrole/textile polyacrylonitrile-derived activated carbon fiber felt as supercapacitor electrodeMatsushima, J. T. ; Rodrigues, A. C. ; Marcuzzo, J. S. ; Cuña, A. ; Baldan, M. R.Journal of materials science. Materials in electronics, 2020-07, Vol.31 (13), p.10225-10233 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
| 10 |
Material Type: Artigo
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3D network-like SnIn4S8/TiO2 for photoelectric electron storage and sustained cathodic protection applications in both light and dark conditions based on nanoarchitectonicsLu, Guiying ; Sun, Mengmeng ; Chen, Zhuoyuan ; Feng, ChangJournal of materials science. Materials in electronics, 2023, Vol.34 (3), p.170, Article 170 [Periódico revisado por pares]New York: Springer USTexto completo disponível |
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