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Refinado por: Base de dados/Biblioteca: Copper Technical Reference Library remover Nome da Publicação: Ieee Transactions On Computer-Aided Design Of Integrated Circuits And Systems remover idioma: Inglês remover
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Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies
Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies
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Modeling of metallic carbon-nanotube interconnects for circuit simulations and a comparison with Cu interconnects for scaled technologies

Raychowdhury, A. ; Roy, K.

IEEE transactions on computer-aided design of integrated circuits and systems, 2006-01, Vol.25 (1), p.58-65 [Periódico revisado por pares]

New York: IEEE

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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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