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Identification of elasto-viscoplastic material parameters by indentation testing and combined finite element modelling and numerical optimization
Identification of elasto-viscoplastic material parameters by indentation testing and combined finite element modelling and numerical optimization
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Identification of elasto-viscoplastic material parameters by indentation testing and combined finite element modelling and numerical optimization

Rauchs, G. ; Bardon, J.

Finite elements in analysis and design, 2011-07, Vol.47 (7), p.653-667 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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2
Identification of the material parameters of a viscous hyperelastic constitutive law from spherical indentation tests of rubber and validation by tensile tests
Identification of the material parameters of a viscous hyperelastic constitutive law from spherical indentation tests of rubber and validation by tensile tests
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Identification of the material parameters of a viscous hyperelastic constitutive law from spherical indentation tests of rubber and validation by tensile tests

Rauchs, G. ; Bardon, J. ; Georges, D.

Mechanics of materials, 2010-11, Vol.42 (11), p.961-973 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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3
A general optimization method using adjoint equation for solving multidimensional inverse heat conduction
A general optimization method using adjoint equation for solving multidimensional inverse heat conduction
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A general optimization method using adjoint equation for solving multidimensional inverse heat conduction

Jarny, Y. ; Ozisik, M.N. ; Bardon, J.P.

International journal of heat and mass transfer, 1991, Vol.34 (11), p.2911-2919 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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4
Mechanical and thermal properties of Cu/Al2O3 systems; effects of substrate surface ion bombardment etching
Mechanical and thermal properties of Cu/Al2O3 systems; effects of substrate surface ion bombardment etching
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Mechanical and thermal properties of Cu/Al2O3 systems; effects of substrate surface ion bombardment etching

Lahmar, A ; Bardon, J P ; Hmina, N

Journal of physics. Condensed matter, 2001-05, Vol.13 (18), p.3931-3940 [Periódico revisado por pares]

Bristol: IOP Publishing

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5
Experimental route to heat conduction beyond the Fourier equation
Experimental route to heat conduction beyond the Fourier equation
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Experimental route to heat conduction beyond the Fourier equation

Guillemet, P. ; Bardon, J.P. ; Rauch, C.

International journal of heat and mass transfer, 1997-10, Vol.40 (17), p.4043-4053 [Periódico revisado por pares]

Oxford: Elsevier Ltd

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6
Correlation between the adhesion and the thermal contact resistance: effects of substrate surface ion bombardment etching
Correlation between the adhesion and the thermal contact resistance: effects of substrate surface ion bombardment etching
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Correlation between the adhesion and the thermal contact resistance: effects of substrate surface ion bombardment etching

Lahmar, A ; Hmina, N ; Scudeller, Y ; Bardon, J.P

Thin solid films, 1998-07, Vol.325 (1), p.156-162 [Periódico revisado por pares]

Lausanne: Elsevier B.V

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7
Imaging charged objects using low-energy-electron coherent beams
Imaging charged objects using low-energy-electron coherent beams
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Imaging charged objects using low-energy-electron coherent beams

Georges, V. ; Bardon, J. ; Degiovanni, A. ; Morin, R.

Ultramicroscopy, 2001-11, Vol.90 (1), p.33-38 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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8
Conducting, semiconducting and insulating objects observed by low-energy electron holography
Conducting, semiconducting and insulating objects observed by low-energy electron holography
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Conducting, semiconducting and insulating objects observed by low-energy electron holography

Bardon, J ; Degiovanni, A ; Georges, V ; Morin, R

Ultramicroscopy, 2002-08, Vol.92 (3), p.133-142 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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9
Thermal contact resistance and adhesion studies on thin copper films on alumina substrates
Thermal contact resistance and adhesion studies on thin copper films on alumina substrates
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Thermal contact resistance and adhesion studies on thin copper films on alumina substrates

Sakami, D. ; Lahmar, A. ; Scudeller, Y. ; Danes, F. ; Bardon, J. P.

Journal of adhesion science and technology, 2001-01, Vol.15 (12), p.1403-1416 [Periódico revisado por pares]

Leiden: Taylor & Francis Group

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10
Thermal contact resistance at the interface of double tubes assembled by plastic deformation
Thermal contact resistance at the interface of double tubes assembled by plastic deformation
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Thermal contact resistance at the interface of double tubes assembled by plastic deformation

Bourouga, B. ; Bardon, J.P.

Experimental thermal and fluid science, 1998-10, Vol.18 (2), p.168-181 [Periódico revisado por pares]

New York, NY: Elsevier Inc

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