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Metal-mesh based transparent electrode on a 3-D curved surface by electrohydrodynamic jet printing
Metal-mesh based transparent electrode on a 3-D curved surface by electrohydrodynamic jet printing
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Metal-mesh based transparent electrode on a 3-D curved surface by electrohydrodynamic jet printing

Seong, Baekhoon ; Yoo, Hyunwoong ; Nguyen, Vu Dat ; Jang, Yonghee ; Ryu, Changkook ; Byun, Doyoung

Journal of micromechanics and microengineering, 2014-09, Vol.24 (9), p.97002-5 [Periódico revisado por pares]

Bristol: IOP Publishing

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2
High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates
High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates
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High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates

Wei, Chuang ; Qin, Hantang ; Ramírez-Iglesias, Nakaira A ; Chiu, Chia-Pin ; Lee, Yuan-shin ; Dong, Jingyan

Journal of micromechanics and microengineering, 2014-04, Vol.24 (4), p.45010-9 [Periódico revisado por pares]

Bristol: IOP Publishing

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3
High-resolution direct-writing of metallic electrodes on flexible substrates for high performance organic field effect transistors
High-resolution direct-writing of metallic electrodes on flexible substrates for high performance organic field effect transistors
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High-resolution direct-writing of metallic electrodes on flexible substrates for high performance organic field effect transistors

Bucella, Sadir G. ; Nava, Giorgio ; Vishunubhatla, Krishna Chaitanya ; Caironi, Mario

Organic electronics, 2013-09, Vol.14 (9), p.2249-2256 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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4
Templated Nanodimple Arrays with Tunable Nanostructures for Sensitive Surface Plasmon Resonance Analysis
Templated Nanodimple Arrays with Tunable Nanostructures for Sensitive Surface Plasmon Resonance Analysis
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Templated Nanodimple Arrays with Tunable Nanostructures for Sensitive Surface Plasmon Resonance Analysis

Chung, Pei-Yu ; Wang, Po-Yuan ; Dou, Xuan ; Jiang, Peng

Journal of physical chemistry. C, 2013-05, Vol.117 (17), p.8933-8940 [Periódico revisado por pares]

Columbus, OH: American Chemical Society

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5
Design and evaluation process of a robust pressure sensor for measurements in boundary layers of liquid fluids
Design and evaluation process of a robust pressure sensor for measurements in boundary layers of liquid fluids
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Design and evaluation process of a robust pressure sensor for measurements in boundary layers of liquid fluids

Beutel, T. ; Leester-Schädel, M. ; Büttgenbach, S.

Microsystem technologies, 2012-08, Vol.18 (7-8), p.893-903 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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6
A miniaturized bulk micromachined triaxial accelerometer fabricated using deep reactive etching through a multilevel thickness membrane
A miniaturized bulk micromachined triaxial accelerometer fabricated using deep reactive etching through a multilevel thickness membrane
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A miniaturized bulk micromachined triaxial accelerometer fabricated using deep reactive etching through a multilevel thickness membrane

Petricca, Luca ; Grinde, Christopher ; Ohlckers, Per

Microsystem technologies : sensors, actuators, systems integration, 2012-05, Vol.18 (5), p.613-622 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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7
A multimaterial electrohydrodynamic jet (E-jet) printing system
A multimaterial electrohydrodynamic jet (E-jet) printing system
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A multimaterial electrohydrodynamic jet (E-jet) printing system

Sutanto, E ; Shigeta, K ; Kim, Y K ; Graf, P G ; Hoelzle, D J ; Barton, K L ; Alleyne, A G ; Ferreira, P M ; Rogers, J A

Journal of micromechanics and microengineering, 2012-04, Vol.22 (4), p.45008-11 [Periódico revisado por pares]

Bristol: IOP Publishing

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8
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
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Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies

AUGUR, R ; CHILD, C ; QUON, R ; KIM, B ; SHENG, H ; HIROOKA, S ; GUPTA, R ; THOMAS, A ; SINGH, S. M ; FANG, Q ; SCHIWON, R ; HAMIEH, B ; AHN, J. H ; WORNYO, E ; ALLEN, S ; KALTALIOGLU, E ; RIBES, G ; ZHANG, G ; FRYXELL, T ; OGINO, A ; SHIMADA, E ; AIZAWA, H ; MINDA, H ; TANG, T. J ; KIM, S. O ; OKI, T ; FUJII, K ; PALLACHALIL, M ; TAKEWAKI, T ; HU, C. K ; SUNDLOF, B ; PERMANA, D ; BOLOM, T ; ENGEL, B ; CLEVENGER, L ; LABELLE, C ; SAPP, B ; NOGAMI, T ; SIMON, A ; SHOBHA, H ; GATES, S ; RYAN, E. T ; BONILLA, G ; DAUBENSPECK, T ; SHAW, T ; KIOUSSIS, D ; OSBORNE, G ; GRILL, A ; EDELSTEIN, D ; RESTAINO, D ; MOLIS, S ; SPOONER, T ; FERREIRA, P ; BIERY, G ; SAMPSON, R ; MASUDA, H ; SRIVASTAVA, R ; ODA, Y ; OGUMA, H

Microelectronic engineering, 2012-04, Vol.92, p.42-44 [Periódico revisado por pares]

Amsterdam: Elsevier

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9
Temperature compensation of micromachined silicon hot wire sensor using ANN technique
Temperature compensation of micromachined silicon hot wire sensor using ANN technique
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Temperature compensation of micromachined silicon hot wire sensor using ANN technique

Laghrouche, M. ; Idjeri, B. ; Hammouche, K. ; Tahanout, M. ; Boussey, J. ; Ameur, S.

Microsystem technologies : sensors, actuators, systems integration, 2012-03, Vol.18 (3), p.237-246 [Periódico revisado por pares]

Berlin/Heidelberg: Springer-Verlag

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10
Global and Local Virtual Metrology Models for a Plasma Etch Process
Global and Local Virtual Metrology Models for a Plasma Etch Process
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Global and Local Virtual Metrology Models for a Plasma Etch Process

Lynn, S. A. ; Ringwood, J. ; MacGearailt, N.

IEEE transactions on semiconductor manufacturing, 2012-02, Vol.25 (1), p.94-103 [Periódico revisado por pares]

New York, NY: IEEE

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