Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Defect-deformational self-organization and nanostructuring of solid surfacesEmel’yanov, V.IMicroelectronic engineering, 2003-09, Vol.69 (2), p.435-445 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
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2 |
Material Type: Artigo
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Nanometer scale linewidth control during etching of polysilicon gates in high-density plasmasJoubert, O ; Pargon, E ; Foucher, J ; Detter, X ; Cunge, G ; Vallier, LMicroelectronic engineering, 2003-09, Vol.69 (2), p.350-357 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
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3 |
Material Type: Artigo
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Wet etching studies of silicon nitride thin films deposited by electron cyclotron resonance (ECR) plasma enhanced chemical vapor depositionSundaram, K.B. ; Sah, R.E. ; Baumann, H. ; Balachandran, K. ; Todi, R.M.Microelectronic engineering, 2003-10, Vol.70 (1), p.109-114 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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4 |
Material Type: Artigo
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A concave-type structure of a Ru electrode capacitor fabricated by the reactive ion etching methodJu, Byong-Sun ; Kim, Hyoun WooMicroelectronic engineering, 2003-10, Vol.70 (1), p.30-34 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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5 |
Material Type: Artigo
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Wavelet analysis of directional variations of plasma etch profileChoi, Seok Rim ; Kim, Byungwhan ; Kim, Beom Soo ; Lee, Kyeong KunMicroelectronic engineering, 2004, Vol.71 (1), p.1-6 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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6 |
Material Type: Artigo
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Study on the etching damage characteristics of PZT thin films after etching in Cl-based plasmaKim, Kyoung-Tae ; Kang, Myoung-Gu ; Kim, Chang-IlMicroelectronic engineering, 2004-05, Vol.71 (3), p.294-300 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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7 |
Material Type: Artigo
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Etching profile of silicon carbide in a NF3/CH4 inductively coupled plasmaKIM, Byungwhan ; SUK YONG LEE ; LEE, Byung-TeakMicroelectronic engineering, 2004-05, Vol.71 (3-4), p.329-334 [Periódico revisado por pares]Amsterdam: Elsevier ScienceTexto completo disponível |
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8 |
Material Type: Artigo
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Investigation of copper removal efficiency on reclaimed wafers with HF-based solutionsAbbadie, A. ; Favier, S. ; Giroud, C. ; Billon, T.Microelectronic engineering, 2004-05, Vol.71 (3), p.310-320 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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9 |
Material Type: Artigo
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Fabrication of silicon nanopillar arrays and application on direct methanol fuel cellTang, Yu-Hsiang ; Huang, Mao-Jung ; Shiao, Ming-Hua ; Yang, Chii-RongMicroelectronic engineering, 2011-08, Vol.88 (8), p.2580-2583 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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10 |
Material Type: Artigo
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Refractive index graded anti-reflection coating for solar cells based on low cost reclaimed siliconLiu, Yufei ; Guy, Owen James ; Patel, Jash ; Ashraf, Huma ; Knight, NickMicroelectronic engineering, 2013-10, Vol.110, p.418-421 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |