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Refinado por: Base de dados/Biblioteca: AUC Wiley Frozen Package in 2012 remover Base de dados/Biblioteca: Copper Technical Reference Library remover
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1
Influence of grain boundaries and interfaces on the electronic structure of polycrystalline CuO thin films
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Influence of grain boundaries and interfaces on the electronic structure of polycrystalline CuO thin films

Morasch, Jan ; Wardenga, Hans F. ; Jaegermann, Wolfram ; Klein, Andreas

Physica status solidi. A, Applications and materials science, 2016-06, Vol.213 (6), p.1615-1624 [Periódico revisado por pares]

Weinheim: Blackwell Publishing Ltd

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2
Copper hexacyanoferrate-polymer composite beads for cesium ion removal: Synthesis, characterization, sorption, and kinetic studies
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Copper hexacyanoferrate-polymer composite beads for cesium ion removal: Synthesis, characterization, sorption, and kinetic studies

Dwivedi, Charu ; Kumar, Amar ; Singh, Krishan Kant ; Juby, Ajish K. ; Kumar, Manmohan ; Wattal, Piaray Kishen ; Bajaj, Parma Nand

Journal of applied polymer science, 2013-07, Vol.129 (1), p.152-160 [Periódico revisado por pares]

Hoboken: Wiley Subscription Services, Inc., A Wiley Company

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3
Controlled electrochemical synthesis of conductive nanopolypyrrole and its application in the design of a solid-state ion sensor
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Controlled electrochemical synthesis of conductive nanopolypyrrole and its application in the design of a solid-state ion sensor

Das, Ishwar ; Agrawal, Namita Rani ; Pandey, Avinash Kumar ; Choudhary, Rinki ; Pandey, P. C.

Journal of applied polymer science, 2015-11, Vol.132 (44), p.np-n/a [Periódico revisado por pares]

Hoboken: Blackwell Publishing Ltd

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4
Degradation of poly(ethylene glycol) by electrolysis during the Cu electroplating: A combined experimental and density functional theory study
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Degradation of poly(ethylene glycol) by electrolysis during the Cu electroplating: A combined experimental and density functional theory study

Won, Yong Sun ; Cho, Donghyun ; Kim, Yunhee ; Lee, Jinuk ; Park, Sung Soo

Journal of applied polymer science, 2010-08, Vol.117 (4), p.2083-2089 [Periódico revisado por pares]

Hoboken: Wiley Subscription Services, Inc., A Wiley Company

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5
Structural and optical properties of Cu3SnS4 sprayed thin films
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Structural and optical properties of Cu3SnS4 sprayed thin films

Bouaziz, M. ; Ouerfelli, J. ; Amlouk, M. ; Belgacem, S.

Physica status solidi. A, Applications and materials science, 2007-10, Vol.204 (10), p.3354-3360 [Periódico revisado por pares]

Berlin: WILEY-VCH Verlag

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6
Effects of pH variation in aqueous solutions on dissolution of copper oxide
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Effects of pH variation in aqueous solutions on dissolution of copper oxide

Ko, Cheon Kwang ; Lee, Won Gyu

Surface and interface analysis, 2010-06, Vol.42 (6-7), p.1128-1130 [Periódico revisado por pares]

Chichester, UK: John Wiley & Sons, Ltd

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7
Real-time investigations of selenization reactions in the system Cu-In-Al-Se
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Real-time investigations of selenization reactions in the system Cu-In-Al-Se

Jost, Stefan ; Hergert, Frank ; Hock, Rainer ; Purwins, Michael ; Enderle, Ralph

Physica status solidi. A, Applications and materials science, 2006-09, Vol.203 (11), p.2581-2587 [Periódico revisado por pares]

Berlin: WILEY-VCH Verlag

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8
Contact effects in Cu(TCNQ) memory devices
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Contact effects in Cu(TCNQ) memory devices

Hefczyc, Artur ; Beckmann, Lars ; Becker, Eike ; Johannes, Hans-Hermann ; Kowalsky, Wolfgang

Physica status solidi. A, Applications and materials science, 2008-03, Vol.205 (3), p.647-655 [Periódico revisado por pares]

Berlin: WILEY-VCH Verlag

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9
Qualitative and quantitative identification of copper oxides
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Qualitative and quantitative identification of copper oxides

Su, Yea-Yang ; Shemenski, Robert M.

Surface and interface analysis, 2008-08, Vol.40 (8), p.1183-1189 [Periódico revisado por pares]

Chichester, UK: John Wiley & Sons, Ltd

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10
Calculation of the angular distribution of the surface excitation parameter for Ti, Fe, Cu, Pd, Ag, and Au
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Calculation of the angular distribution of the surface excitation parameter for Ti, Fe, Cu, Pd, Ag, and Au

Pauly, N. ; Tougaard, S.

Surface and interface analysis, 2008-03, Vol.40 (3-4), p.731-733 [Periódico revisado por pares]

Chichester, UK: John Wiley & Sons, Ltd

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