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Refinado por: Base de dados/Biblioteca: Aluminium Industry Abstracts remover Nome da Publicação: Journal Of Physics. Conference Series remover
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Tool Life Prediction for Ceramic Tools in Intermittent Turning of Hardened Steel Based on Damage Evolution Model
Tool Life Prediction for Ceramic Tools in Intermittent Turning of Hardened Steel Based on Damage Evolution Model
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Tool Life Prediction for Ceramic Tools in Intermittent Turning of Hardened Steel Based on Damage Evolution Model

Cui, Xiaobin ; Zhao, Jun ; Zhou, Yonghui ; Zheng, Guangming

Journal of physics. Conference series, 2011-01, Vol.305 (1), p.12111-9 [Periódico revisado por pares]

Bristol: IOP Publishing

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2
Prediction of crack growth direction by Strain Energy Sih's Theory on specimens SEN under tension-compression biaxial loading employing Genetic Algorithms
Prediction of crack growth direction by Strain Energy Sih's Theory on specimens SEN under tension-compression biaxial loading employing Genetic Algorithms
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Prediction of crack growth direction by Strain Energy Sih's Theory on specimens SEN under tension-compression biaxial loading employing Genetic Algorithms

Rodríguez-Martínez, R ; Lugo-González, E ; Urriolagoitia-Calderón, G ; Urriolagoitia-Sosa, G ; Hernández-Gómez L, H ; Romero-Ángeles, B ; Torres-San Miguel, Ch

Journal of physics. Conference series, 2011-01, Vol.305 (1), p.12052-8 [Periódico revisado por pares]

Bristol: IOP Publishing

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3
Comparison of several methods for damage localization using indices and contributions based on PCA
Comparison of several methods for damage localization using indices and contributions based on PCA
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Comparison of several methods for damage localization using indices and contributions based on PCA

Tibaduiza, D A ; Mujica, L E ; Rodellar, J

Journal of physics. Conference series, 2011-07, Vol.305 (1), p.12013-10 [Periódico revisado por pares]

Bristol: IOP Publishing

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4
Shock Deformation of Coarse Grain Alumina above HEL
Shock Deformation of Coarse Grain Alumina above HEL
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Shock Deformation of Coarse Grain Alumina above HEL

Mukhopadhyay, A K ; Joshi, K D ; Dey, A ; Chakraborty, R ; Rav, A ; Ghosh, J ; Bysakh, S ; Biswas, S K ; Gupta, S C

Journal of physics. Conference series, 2012-01, Vol.377 (1), p.12043-5 [Periódico revisado por pares]

Bristol: IOP Publishing

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5
3D Digital Image Correlation (DIC) analysis in relation to damage development in third generation AA2050-T851 aluminium alloy
3D Digital Image Correlation (DIC) analysis in relation to damage development in third generation AA2050-T851 aluminium alloy
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3D Digital Image Correlation (DIC) analysis in relation to damage development in third generation AA2050-T851 aluminium alloy

Lopez-Pedrosa, M ; Zanganeh, M ; Tai, Y H ; Pinna, C

Journal of physics. Conference series, 2012-01, Vol.382 (1), p.12034-4 [Periódico revisado por pares]

Bristol: IOP Publishing

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6
Crush Can Behaviour as an Energy Absorber in a Frontal Impact
Crush Can Behaviour as an Energy Absorber in a Frontal Impact
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Crush Can Behaviour as an Energy Absorber in a Frontal Impact

Bhuyan, Atanu ; Ganilova, Olga

Journal of physics. Conference series, 2012-01, Vol.382 (1), p.12009-7 [Periódico revisado por pares]

Bristol: IOP Publishing

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7
The sigmoidal average – a powerful tool for predicting the thermal conductivity of composite ceramics
The sigmoidal average – a powerful tool for predicting the thermal conductivity of composite ceramics
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The sigmoidal average – a powerful tool for predicting the thermal conductivity of composite ceramics

Pabst, W ; Gregorová, E

Journal of physics. Conference series, 2012-01, Vol.395 (1), p.12021-8 [Periódico revisado por pares]

Bristol: IOP Publishing

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8
Damage Evolution Mechanisms in Plate Impact of Alumina
Damage Evolution Mechanisms in Plate Impact of Alumina
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Damage Evolution Mechanisms in Plate Impact of Alumina

Mukhopadhyay, A K ; Joshi, K D ; Dey, A ; Chakraborty, R ; Rav, A ; Ghosh, J ; Bysakh, S ; Gupta, S C

Journal of physics. Conference series, 2012-07, Vol.377 (1), p.12046-4 [Periódico revisado por pares]

Bristol: IOP Publishing

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9
Bonding of copper to silicon chips using vapor-deposited tin film
Bonding of copper to silicon chips using vapor-deposited tin film
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Bonding of copper to silicon chips using vapor-deposited tin film

Fujimoto, T ; Fukumoto, S ; Miyazaki, T ; Kashiba, Y ; Shiotani, K ; Fujimoto, K

Journal of physics. Conference series, 2012-08, Vol.379 (1), p.12026-7 [Periódico revisado por pares]

Bristol: IOP Publishing

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10
Numerical analysis of interfacial deformation and temperature rise during ultrasonic Al ribbon bonding
Numerical analysis of interfacial deformation and temperature rise during ultrasonic Al ribbon bonding
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Numerical analysis of interfacial deformation and temperature rise during ultrasonic Al ribbon bonding

Takahashi, Yasuo ; Suzuki, Shinji ; Ohyama, Yusuke ; Maeda, Masakatsu

Journal of physics. Conference series, 2012-08, Vol.379 (1), p.12028-11 [Periódico revisado por pares]

Bristol: IOP Publishing

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