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1
Use of exposure compensation to improve device performance for speed and binning based on electrical parametric feedback into fabrication design
Material Type:
Ata de Congresso
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Use of exposure compensation to improve device performance for speed and binning based on electrical parametric feedback into fabrication design

Ackmann, Paul W ; Brown, Stuart E ; Edwards, Richard D ; Downey, Doug ; Michael, Mark ; Turnquest, Karen L ; Nistler, John L

SPIE 1997

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2
A Hierarchical Discriminant Analysis for Species Identification in Raw Meat by Visible and near Infrared Spectroscopy
Material Type:
Artigo
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A Hierarchical Discriminant Analysis for Species Identification in Raw Meat by Visible and near Infrared Spectroscopy

Arnalds, Thorsteinn ; McElhinney, John ; Fearn, Tom ; Downey, Gerard

Journal of near infrared spectroscopy (United Kingdom), 2004-06, Vol.12 (3), p.183-188 [Periódico revisado por pares]

London, England: SAGE Publications

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3
Low Temperature Shallow Junction Formation For 70nm Technology Node And Beyond
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Artigo
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Low Temperature Shallow Junction Formation For 70nm Technology Node And Beyond

Borland, John O.

MRS proceedings, 2002, Vol.717, Article C1.1

New York, USA: Cambridge University Press

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4
Silicon carbide UV photodiodes
Material Type:
Artigo
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Silicon carbide UV photodiodes

Brown, D.M. ; Downey, E.T. ; Ghezzo, M. ; Kretchmer, J.W. ; Saia, R.J. ; Liu, Y.S. ; Edmond, J.A. ; Gati, G. ; Pimbley, J.M. ; Schneider, W.E.

IEEE transactions on electron devices, 1993-02, Vol.40 (2), p.325-333 [Periódico revisado por pares]

New York, NY: IEEE

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5
SiC MOS interface characteristics
Material Type:
Artigo
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SiC MOS interface characteristics

Brown, D.M. ; Ghezzo, M. ; Kretchmer, J. ; Downey, E. ; Pimbley, J. ; Palmour, J.

IEEE transactions on electron devices, 1994-04, Vol.41 (4), p.618-620 [Periódico revisado por pares]

New York, NY: IEEE

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6
Probabilistic bounds on the performance of list scheduling
Material Type:
Artigo
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Probabilistic bounds on the performance of list scheduling

BRUNO, J. L ; DOWNEY, P. J

SIAM journal on computing, 1986-05, Vol.15 (2), p.409-417 [Periódico revisado por pares]

Philadelphia, PA: Society for Industrial and Applied Mathematics

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7
Complexity of Task Sequencing with Deadlines, Set-Up Times and Changeover Costs
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Artigo
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Complexity of Task Sequencing with Deadlines, Set-Up Times and Changeover Costs

Bruno, John ; Downey, Peter

SIAM journal on computing, 1978-11, Vol.7 (4), p.393-404 [Periódico revisado por pares]

Philadelphia: Society for Industrial and Applied Mathematics

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8
PCAM: a multi-user facility-based protein crystallization apparatus for microgravity
Material Type:
Artigo
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PCAM: a multi-user facility-based protein crystallization apparatus for microgravity

Carter, Daniel C. ; Wright, Brenda ; Miller, Teresa ; Chapman, Jenny ; Twigg, Pam ; Keeling, Kim ; Moody, Kerry ; White, Melissa ; Click, James ; Ruble, John R. ; Ho, Joseph X. ; Adcock-Downey, Lawana ; Dowling, Tim ; Chang, Chong-Hwan ; Ala, Paul ; Rose, John ; Wang, B.C. ; Declercq, Jean-Paul ; Evrard, Christine ; Rosenberg, John ; Wery, Jean-Pierre ; Clawson, David ; Wardell, Mark ; Stallings, W. ; Stevens, A.

Journal of crystal growth, 1999-01, Vol.196 (2), p.610-622 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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9
Diffusion-controlled crystallization apparatus for microgravity (DCAM): flight and ground-based applications
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Artigo
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Diffusion-controlled crystallization apparatus for microgravity (DCAM): flight and ground-based applications

Carter, Daniel C. ; Wright, Brenda ; Miller, Teresa ; Chapman, Jenny ; Twigg, Pam ; Keeling, Kim ; Moody, Kerry ; White, Melissa ; James Click ; Ruble, John R. ; Ho, Joseph X. ; Adcock-Downey, Lawana ; Bunick, Gerard ; Harp, Joel

Journal of crystal growth, 1999-01, Vol.196 (2), p.602-609 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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10
Picosecond dynamics of a gain-switched InGaAsP laser
Material Type:
Artigo
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Picosecond dynamics of a gain-switched InGaAsP laser

Downey, P. ; Bowers, J. ; Tucker, R. ; Agyekum, E.

IEEE J. Quant. Electron.; (United States), 1987-06, Vol.23 (6), p.1039-1047 [Periódico revisado por pares]

United States: IEEE

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