Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Ata de Congresso
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Hardware Building Blocks for High Data-Rate Fault-Tolerant In-vehicle NetworkingBaronti, F. ; Saponara, S. ; Petri, E. ; Roncella, R. ; Saletti, R. ; Fanucci, L. ; D'Abramo, P.2007 IEEE International Symposium on Industrial Electronics, 2007, p.89-94IEEETexto completo disponível |
2 |
Material Type: Ata de Congresso
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Experiencing with AMR sensor conditioning in automotive fieldBattini, F. ; Tonarelli, M. ; Fanucci, L. ; De Marinis, M. ; Giambastiani, A.2007 Ph.D Research in Microelectronics and Electronics Conference, 2007, p.205-208IEEETexto completo disponível |
3 |
Material Type: Artigo
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Design and Test of an HV-CMOS Intelligent Power Switch With Integrated Protections and Self-Diagnostic for Harsh Automotive ApplicationsCostantino, N ; Serventi, R ; Tinfena, F ; D'Abramo, P ; Chassard, P ; Tisserand, P ; Saponara, S ; Fanucci, LIEEE transactions on industrial electronics (1982), 2011-07, Vol.58 (7), p.2715-2727 [Periódico revisado por pares]New York: IEEETexto completo disponível |
4 |
Material Type: Ata de Congresso
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Platform Based Design for Automotive Sensor ConditioningFanucci, L. ; Giambastiani, A. ; Iozzi, F. ; Marino, C. ; Rocchi, A.Design, Automation and Test in Europe, 2005, p.186-191Washington, DC, USA: IEEE Computer SocietyTexto completo disponível |
5 |
Material Type: Ata de Congresso
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Pin-limited frequency converter IP bridge for efficient communication of automotive IC sensors with off-chip ECUsSaponara, S. ; Cecchini, T. ; Sechi, F. ; Fanucci, L.2009 IEEE International Workshop on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications, 2009, p.167-171IEEETexto completo disponível |
6 |
Material Type: Artigo
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A Flexible LED Driver for Automotive Lighting Applications: IC Design and Experimental CharacterizationSaponara, S. ; Pasetti, G. ; Costantino, N. ; Tinfena, F. ; D'Abramo, P. ; Fanucci, L.IEEE transactions on power electronics, 2012-03, Vol.27 (3), p.1071-1075 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |