7 Resultados para Busca Geral
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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Ata de Congresso
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A thermodynamic model for electrical current induced damageBasaran, C. ; Minghui Lin ; Hua Ye2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1738-1745 Vol.2Piscataway NJ: IEEETexto completo disponível |
| 2 |
Material Type: Artigo
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A thermodynamic model for electrical current induced damageBasaran, Cemal ; Lin, Minghui ; Ye, HuaInternational journal of solids and structures, 2003-12, Vol.40 (26), p.7315-7327 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 3 |
Material Type: Artigo
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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental studyYao, Wei ; Basaran, CemalInternational journal of damage mechanics, 2014-03, Vol.23 (2), p.203-221 [Periódico revisado por pares]London, England: SAGE PublicationsTexto completo disponível |
| 4 |
Material Type: Ata de Congresso
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Damage mechanics of microelectronics solder joints under high current densitiesHua Ye ; Basaran, C. ; Hopkins, D.C. ; Frear, D. ; Jong-Kai Lin2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.988-997 Vol.1Piscataway NJ: IEEETexto completo disponível |
| 5 |
Material Type: Artigo
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Damage mechanics of microelectronics solder joints under high current densitiesYe, Hua ; Basaran, Cemal ; Hopkins, Douglas C.International journal of solids and structures, 2003-07, Vol.40 (15), p.4021-4032 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 6 |
Material Type: Artigo
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Simulating Damage Mechanics of Electromigration and ThermomigrationShidong Li ; Abdulhamid, Mohd F. ; Basaran, CemalSimulation (San Diego, Calif.), 2008-08, Vol.84 (8-9), p.391-401 [Periódico revisado por pares]London, England: SAGE PublicationsTexto completo disponível |
| 7 |
Material Type: Artigo
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Thermomigration Versus Electromigration in Microelectronics Solder JointsAbdulhamid, M.F. ; Basaran, C. ; Yi-Shao LaiIEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635Piscataway, NJ: IEEETexto completo disponível |
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- Semiconductor Electronics. Microelectronics. Optoelectronics. Solid State Devices (4)
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