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Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
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Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm

Gomez, Juan ; Basaran, Cemal

Mechanics of materials, 2006-07, Vol.38 (7), p.585-598 [Periódico revisado por pares]

Lausanne: Elsevier Ltd

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2
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Yao, Wei ; Basaran, Cemal

International journal of damage mechanics, 2014-03, Vol.23 (2), p.203-221 [Periódico revisado por pares]

London, England: SAGE Publications

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3
Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
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Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model

Yao, Wei ; Basaran, Cemal

Computational materials science, 2013-04, Vol.71, p.76-88 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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4
Impact of temperature cycle profile on fatigue life of solder joints
Impact of temperature cycle profile on fatigue life of solder joints
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Impact of temperature cycle profile on fatigue life of solder joints

Dishongh, T. ; Basaran, C. ; Cartwright, A.N. ; Ying Zhao ; Heng Liu

IEEE transactions on advanced packaging, 2002-08, Vol.25 (3), p.433-438

Piscataway, NY: IEEE

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5
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
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Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, C. ; Yujun Wen

IEEE transactions on advanced packaging, 2006-11, Vol.29 (4), p.666-673

Piscataway, NY: IEEE

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6
Low temperature electromigration and thermomigration in lead-free solder joints
Low temperature electromigration and thermomigration in lead-free solder joints
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Low temperature electromigration and thermomigration in lead-free solder joints

Basaran, Cemal ; Abdulhamid, Mohd F.

Mechanics of materials, 2009-11, Vol.41 (11), p.1223-1241 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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7
Thermomigration Versus Electromigration in Microelectronics Solder Joints
Thermomigration Versus Electromigration in Microelectronics Solder Joints
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Thermomigration Versus Electromigration in Microelectronics Solder Joints

Abdulhamid, M.F. ; Basaran, C. ; Yi-Shao Lai

IEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635

Piscataway, NJ: IEEE

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