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A thermodynamic model for electrical current induced damage
A thermodynamic model for electrical current induced damage
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A thermodynamic model for electrical current induced damage

Basaran, C. ; Minghui Lin ; Hua Ye

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1738-1745 Vol.2

Piscataway NJ: IEEE

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An analytical model for thermal stress analysis of multi-layered microelectronics packaging
An analytical model for thermal stress analysis of multi-layered microelectronics packaging
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An analytical model for thermal stress analysis of multi-layered microelectronics packaging

Yujun Wen ; Basaran, C.

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1592-1601 Vol.2

Piscataway NJ: IEEE

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3
Damage mechanics of microelectronics solder joints under high current densities
Damage mechanics of microelectronics solder joints under high current densities
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Damage mechanics of microelectronics solder joints under high current densities

Hua Ye ; Basaran, C. ; Hopkins, D.C. ; Frear, D. ; Jong-Kai Lin

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.988-997 Vol.1

Piscataway NJ: IEEE

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4
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
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Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, C. ; Yujun Wen

IEEE transactions on advanced packaging, 2006-11, Vol.29 (4), p.666-673

Piscataway, NY: IEEE

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5
Thermomigration Versus Electromigration in Microelectronics Solder Joints
Thermomigration Versus Electromigration in Microelectronics Solder Joints
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Thermomigration Versus Electromigration in Microelectronics Solder Joints

Abdulhamid, M.F. ; Basaran, C. ; Yi-Shao Lai

IEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635

Piscataway, NJ: IEEE

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