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1
A thermodynamic model for electrical current induced damage
A thermodynamic model for electrical current induced damage
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A thermodynamic model for electrical current induced damage

Basaran, C. ; Minghui Lin ; Hua Ye

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1738-1745 Vol.2

Piscataway NJ: IEEE

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2
An analytical model for thermal stress analysis of multi-layered microelectronics packaging
An analytical model for thermal stress analysis of multi-layered microelectronics packaging
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An analytical model for thermal stress analysis of multi-layered microelectronics packaging

Yujun Wen ; Basaran, C.

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1592-1601 Vol.2

Piscataway NJ: IEEE

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3
Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages
Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages
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Application of MoirÉ Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages

Liu, Heng ; Basaran, C ; Cartwright, A N ; Casey, W

IEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.217-223 [Periódico revisado por pares]

New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)

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4
Damage mechanics of microelectronics solder joints under high current densities
Damage mechanics of microelectronics solder joints under high current densities
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Damage mechanics of microelectronics solder joints under high current densities

Hua Ye ; Basaran, C. ; Hopkins, D.C. ; Frear, D. ; Jong-Kai Lin

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.988-997 Vol.1

Piscataway NJ: IEEE

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5
Impact of temperature cycle profile on fatigue life of solder joints
Impact of temperature cycle profile on fatigue life of solder joints
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Impact of temperature cycle profile on fatigue life of solder joints

Dishongh, T. ; Basaran, C. ; Cartwright, A.N. ; Ying Zhao ; Heng Liu

IEEE transactions on advanced packaging, 2002-08, Vol.25 (3), p.433-438

Piscataway, NY: IEEE

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6
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
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Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, C. ; Yujun Wen

IEEE transactions on advanced packaging, 2006-11, Vol.29 (4), p.666-673

Piscataway, NY: IEEE

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7
Thermomigration Versus Electromigration in Microelectronics Solder Joints
Thermomigration Versus Electromigration in Microelectronics Solder Joints
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Thermomigration Versus Electromigration in Microelectronics Solder Joints

Abdulhamid, M.F. ; Basaran, C. ; Yi-Shao Lai

IEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635

Piscataway, NJ: IEEE

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