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Refinado por: Base de dados/Biblioteca: ANTE: Abstracts in New Technology & Engineering remover assunto: Mechanical Properties And Methods Of Testing. Rheology. Fracture Mechanics. Tribology remover Condensed Matter: Structure, Mechanical And Thermal Properties remover
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1
Strong crystal size effect on deformation twinning
Strong crystal size effect on deformation twinning
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Strong crystal size effect on deformation twinning

Li, Ju ; Sun, Jun ; Yu, Qian ; Shan, Zhi-Wei ; Huang, Xiaoxu ; Xiao, Lin ; Ma, Evan

Nature (London), 2010-01, Vol.463 (7279), p.335-338 [Periódico revisado por pares]

London: Nature Publishing Group

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2
Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles
Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles
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Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

El-Daly, A. A. ; Fawzy, A. ; Mansour, S. F. ; Younis, M. J.

Journal of materials science. Materials in electronics, 2013-08, Vol.24 (8), p.2976-2988 [Periódico revisado por pares]

Boston: Springer US

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3
Super Plastic Bulk Metallic Glasses at Room Temperature
Super Plastic Bulk Metallic Glasses at Room Temperature
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Super Plastic Bulk Metallic Glasses at Room Temperature

Liu, Yan Hui ; Wang, Gang ; Wang, Ru Ju ; Zhao, De Qian ; Pan, Ming Xiang ; Wang, Wei Hua

Science (American Association for the Advancement of Science), 2007-03, Vol.315 (5817), p.1385-1388 [Periódico revisado por pares]

Washington, DC: American Association for the Advancement of Science

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4
Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface
Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface
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Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Pan, Guoshun ; Zhou, Yan ; Luo, Guihai ; Shi, Xiaolei ; Zou, Chunli ; Gong, Hua

Journal of materials science. Materials in electronics, 2013-12, Vol.24 (12), p.5040-5047 [Periódico revisado por pares]

Boston: Springer US

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5
A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
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A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Zeng, Guang ; Xue, Songbai ; Zhang, Liang ; Gao, Lili ; Dai, Wei ; Luo, Jiadong

Journal of materials science. Materials in electronics, 2010-05, Vol.21 (5), p.421-440 [Periódico revisado por pares]

Boston: Springer US

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6
Effects of rare earths on properties and microstructures of lead-free solder alloys
Effects of rare earths on properties and microstructures of lead-free solder alloys
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Effects of rare earths on properties and microstructures of lead-free solder alloys

Zhang, Liang ; Xue, Song-bai ; Gao, Li-li ; Zeng, Guang ; Sheng, Zhong ; Chen, Yan ; Yu, Sheng-lin

Journal of materials science. Materials in electronics, 2009-08, Vol.20 (8), p.685-694 [Periódico revisado por pares]

Boston: Springer US

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7
Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy
Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy
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Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy

Fawzy, A. ; Fayek, S. A. ; Sobhy, M. ; Nassr, E. ; Mousa, M. M. ; Saad, G.

Journal of materials science. Materials in electronics, 2013-09, Vol.24 (9), p.3210-3218 [Periódico revisado por pares]

Boston: Springer US

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8
Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints
Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints
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Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints

Sona, Mrunali ; Prabhu, K. N.

Journal of materials science. Materials in electronics, 2013-09, Vol.24 (9), p.3149-3169 [Periódico revisado por pares]

Boston: Springer US

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9
The effect of Pr addition on superconducting and mechanical properties of Bi-2212 superconductors
The effect of Pr addition on superconducting and mechanical properties of Bi-2212 superconductors
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The effect of Pr addition on superconducting and mechanical properties of Bi-2212 superconductors

Ozturk, O. ; Asikuzun, E. ; Erdem, M. ; Yildirim, G. ; Yildiz, O. ; Terzioglu, C.

Journal of materials science. Materials in electronics, 2012-02, Vol.23 (2), p.511-519 [Periódico revisado por pares]

Boston: Springer US

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10
Deposition of conductive materials on textile and polymeric flexible substrates
Deposition of conductive materials on textile and polymeric flexible substrates
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Deposition of conductive materials on textile and polymeric flexible substrates

Lacerda Silva, N. ; Gonçalves, L. M. ; Carvalho, H.

Journal of materials science. Materials in electronics, 2013-02, Vol.24 (2), p.635-643 [Periódico revisado por pares]

Boston: Springer US

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