Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: magazinearticle
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Sam Middleton rediscoveredBush, TeresiaThe International review of African American art, 2003-01, Vol.19 (2), p.3 [Periódico revisado por pares]Hampton: Hampton University MuseumTexto completo disponível |
2 |
Material Type: magazinearticle
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ArticleBush, George WMonthly review (New York. 1949), 2008-12, Vol.60 (7), p.29 [Periódico revisado por pares]New York: Monthly Review PressTexto completo disponível |
3 |
Material Type: magazinearticle
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Fill in the Blanks. By this Definition the U.S. is a LeadingBush, George WMonthly review (New York. 1949), 2002-02, Vol.53 (9), p.23 [Periódico revisado por pares]New York: Monthly Review PressTexto completo disponível |
4 |
Material Type: magazinearticle
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A Rural View of Rural Free DeliveryBush, E TThe North American review, 1906-03, Vol.182 (3), p.381 [Periódico revisado por pares]Boston, Mass., etc: North American Review Corp., etcTexto completo disponível |
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Material Type: magazinearticle
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"The way to win a presidential race against the Republicans is to Develop the class warfare issueBush, George H W ; Phillips, KevinMonthly review (New York. 1949), 2002-10, Vol.54 (5), p.55 [Periódico revisado por pares]New York: Monthly Review PressTexto completo disponível |
6 |
Material Type: magazinearticle
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The President's PanaceaRice, Allen Thorndike ; Jones, B. F. ; Ely, George H. ; Jarrett, John ; Conger, A. L. ; Bates, Stockton ; Shallenberger, W. S. ; Chace, Jonathan ; Hartshorn, E. A. ; Wyckoff, Wm. C. ; McDaniels, Walter H. ; De Armit, Wm. P. ; Russell, Wm. A. ; De Pauw, N. T. ; Bush, Louis ; Varnum, John P. ; Thurber, H. K. ; Dudley, Thomas H.The North American review, 1888-01, Vol.146 (377), p.436-466 [Periódico revisado por pares]Boston, Mass., etc: The North American ReviewTexto completo disponível |
7 |
Material Type: magazinearticle
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Investigation and minimization of underfill delamination in flip chip packagesZhai, C.J. ; Sidharth ; Blish, R.C. ; Master, R.N.IEEE transactions on device and materials reliability, 2004-03, Vol.4 (1), p.86-91 [Periódico revisado por pares]New York: IEEETexto completo disponível |