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Development and Analysis of a Multimaterial FDM 3D Printed Capacitive Accelerometer
Barile, Gianluca ; Esposito, Paolo ; Stornelli, Vincenzo ; Ferri, Giuseppe
Access, IEEE, 2023, Vol.11, p.40175-40181
IEEE
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2
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Face ShapeNets for 3D Face Recognition
Jabberi, Marwa ; Wali, Ali ; Neji, Bilel ; Beyrouthy, Taha ; Alimi, Adel M
Access, IEEE, 2023, Vol.11, p.46240-46256
IEEE
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HyperLabels: Browsing of Dense and Hierarchical Molecular 3D Models
Kouril, David ; Isenberg, Tobias ; Kozlikova, Barbora ; Meyer, Miriah ; Groller, M. Eduard ; Viola, Ivan
Visualization and Computer Graphics, IEEE Transactions on, 2021, Vol.27, p.3493-3504
IEEE
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3D Model Classification Based on GCN and SVM
Gao, Xue-Yao ; Yuan, Qing-Xian ; Zhang, Chun-Xiang
Access, IEEE, 2022, Vol.10, p.121494-121507
IEEE
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Monocular 3D Object Detection With Motion Feature Distillation
Hu, Henan ; Li, Muyu ; Zhu, Ming ; Gao, Wen ; Liu, Peiyu ; Chan, Kwok-Leung
Access, IEEE, 2023, Vol.11, p.82933-82945
IEEE
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Anisotropic Conductivity of Rat Head Phantom and its Influence on Electroencephalogram Source Localization
Lacik, Jaroslav ; Koudelka, Vlastimil ; Vejmola, Cestmir ; Kuratko, David ; Vanek, Jiri ; Wojcik, Daniel Krzysztof ; Palenicek, Tomas ; Raida, Zbynek
Access, IEEE, 2022, Vol.10, p.9877-9888
IEEE
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Retrieving Land Surface Temperature From Chinese FY-3D MERSI-2 Data Using an Operational Split Window Algorithm
Tang, Kai ; Zhu, Hongchun ; Ni, Ping ; Li, Ruibo ; Fan, Cheng
Selected Topics in Applied Earth Observations and Remote Sensing, IEEE Journal of, 2021, Vol.14, p.6639-6651
IEEE
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IEEE Draft Recommended Practice for Three-Dimensional (3D) Medical Modelling
IEEE P3333.2.1/D1, May 2014, 2014, p.1-26
IEEE
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Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss
Chandrakar, Shivangi ; Gupta, Deepika ; Majumder, Manoj Kumar ; Kaushik, Brajesh Kumar
Nanotechnology, IEEE Open Journal of, 2022, Vol.3, p.227-235
IEEE
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End-to-End Visual Domain Adaptation Network for Cross-Domain 3D CPS Data Retrieval
Liu, An-An ; Xiang, Shu ; Nie, Wei-Zhi ; Song, Dan
Access, IEEE, 2019, Vol.7, p.118630-118638
IEEE
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