Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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(0 0 0 1) oriented GaN epilayer grown on [formula omitted] sapphire by MOCVDBai, J. ; Wang, T. ; Li, H.D. ; Jiang, N. ; Sakai, S.Journal of crystal growth, 2001-09, Vol.231 (1), p.41-47 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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2 |
Material Type: Artigo
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(0 0 1) V surface structures analysed by RHEED and STMDulot, F. ; Turban, P. ; Kierren, B. ; Eugène, J. ; Alnot, M. ; Andrieu, S.Surface science, 2001-02, Vol.473 (3), p.172-182 [Periódico revisado por pares]Lausanne: Elsevier B.VTexto completo disponível |
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3 |
Material Type: Artigo
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[0 1 0] dislocations in the complex metallic alloy ξ ′-Al–Pd–MnFeuerbacher, M ; Caillard, DActa materialia, 2004-03, Vol.52 (5), p.1297-1304 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
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4 |
Material Type: Artigo
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0.05-μm-gate InAlAs/InGaAs high electron mobility transistor and reduction of its short-channel effectsENOKI, T ; TOMIZAWA, M ; UMEDA, Y ; ISHII, YJapanese Journal of Applied Physics, 1994, Vol.33 (1B), p.798-803 [Periódico revisado por pares]Tokyo: Japanese journal of applied physicsTexto completo disponível |
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5 |
Material Type: Artigo
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0.1-Micrometer scaling by 1:1 synchrotron radiation lithographyMochiji, K ; Ogawa, T ; Oizumil, H ; Soga, TMicroelectronic engineering, 1992-11, Vol.18 (4), p.333-340 [Periódico revisado por pares]AMSTERDAM: Elsevier B.VTexto completo disponível |
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6 |
Material Type: Artigo
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0.1- mu m-gate, ultrathin-film CMOS devices using SIMOX substrate with 80-nm-thick buried oxide layerOmura, Y. ; Nakashima, S. ; Izumi, K. ; Ishii, T.IEEE transactions on electron devices, 1993-05, Vol.40 (5), p.1019-1022 [Periódico revisado por pares]New York, NY: IEEETexto completo disponível |
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7 |
Material Type: Artigo
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0.1 nm information limit with the CM30FEG-special TübingenLichte, Hannes ; Kessler, Peter ; Lenz, Friedrich ; Rau, Wolf-DieterUltramicroscopy, 1993, Vol.52 (3), p.575-580 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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8 |
Material Type: Ata de Congresso
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0.1 μm InGaAs/InAlAs/InP HEMT MMICs: a flight qualified technologyCHOU, Y. C ; LEUNG, D ; LAI, R ; GRUNDBACHER, R ; BARSKY, M ; KAN, Q ; TSAI, RTechnical digest - IEEE Gallium Arsenide Integrated Circuit Symposium, 2002, p.77-80Piscataway NJ: IEEETexto completo disponível |
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9 |
Material Type: Ata de Congresso
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0.1 μm RFCMOS on high resistivity substrates for system on chip (SOC) applicationsYANG, J.-Y ; BENAISSA, K ; ASHBURN, S ; MADHANI, P ; BLYTHE, T ; SHICHIJO, H ; CRENSHAW, D ; WILLIAMS, B ; SRIDHAR, S ; AI, J ; BOSELLI, G ; ZHAO, S ; TANG, S.-P ; MAHALINGAM, NPiscataway NJ: IEEE 2002Texto completo disponível |
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10 |
Material Type: Artigo
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0.10 μm TiSi2 technology utilizing nitrogen diffusion controlled RTAMATSUBARA, Y ; SAKAI, T ; ISHIGAMI, T ; ANDO, K ; HORIUCHI, TThin solid films, 1995-12, Vol.270 (1-2), p.537-543 [Periódico revisado por pares]Lausanne: Elsevier ScienceTexto completo disponível |