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Refinado por: assunto: Electronics Packaging remover
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1
PIXAPP Photonics Packaging Pilot Line - Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity
PIXAPP Photonics Packaging Pilot Line - Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity
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PIXAPP Photonics Packaging Pilot Line - Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

Bundalo, Ivan-Lazar ; Morrissey, Padraic E. ; Annoni, Andrea ; Baets, Roel ; Blache, Fabrice ; Breyne, Laurens ; Carrol, Lee ; Collins, Sean ; Dietrich, Philipp-Immanuel ; Halmo, Leos ; Jorge, Filipe ; Karppinen, Mikko ; Kaunisto, Mikko ; Kelly, Brian ; Van Kerrebrouck, Joris ; Koos, Christian ; Lahti, Markku ; Lambrecht, Joris ; Marcello, Tienforti ; Lee, Junsu Su ; Missinne, Jeroen ; Ossieur, Peter ; Pessina, Roberto ; Sterken, Tom ; Van Steenberge, Geert ; Vannucci, Antonello ; Vannucchi, Alessandro ; Verplancke, Rik ; Wuytens, Pieter ; Xu, Yilin ; Zoldak, Martin ; OaBrien, Peter

IEEE journal of selected topics in quantum electronics, 2022-05, Vol.28 (3: Hybrid Integration for Silicon Photonics), p.1-11 [Periódico revisado por pares]

IEEE

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2
Optical and Electronic Packaging Processes for Silicon Photonic Systems
Optical and Electronic Packaging Processes for Silicon Photonic Systems
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Optical and Electronic Packaging Processes for Silicon Photonic Systems

Pavarelli, Nicola ; Jun Su Lee ; Rensing, Marc ; Scarcella, Carmelo ; Shiyu Zhou ; Ossieur, Peter ; O'Brien, Peter A.

Journal of lightwave technology, 2015-03, Vol.33 (5), p.991-997 [Periódico revisado por pares]

New York: IEEE

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3
Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors
Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors
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Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Stoukatch, Serguei ; Fagnard, Jean-Francois ; Dupont, Francois ; Laurent, Philippe ; Debliquy, Marc ; Redoute, Jean-Michel

IEEE access, 2022-01, Vol.10, p.19242-19253 [Periódico revisado por pares]

Piscataway: IEEE

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4
Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging
Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging
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Inductive Heating Based on VHF-ISM Radio Band Frequencies as Technology Platform for Efficient Heating of Metallic Micro-Scaled Bonding Layers in MEMS Packaging

Hofmann, Christian ; Kroll, Martin ; Panhale, Sushant ; Wiemer, Maik ; Kunke, Andreas ; Hiller, Karla ; Kuhn, Harald

IEEE transactions on magnetics, 2023-11, Vol.59 (11), p.1-1

New York: IEEE

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5
Antenna and Package Design for 61- and 122-GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology
Antenna and Package Design for 61- and 122-GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology
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Antenna and Package Design for 61- and 122-GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology

Frank, Martin ; Reissland, Torsten ; Lurz, Fabian ; Voelkel, Matthias ; Lambrecht, Franziska ; Kiefl, Stefan ; Ghesquiere, Pol ; Jalli Ng, Herman ; Kissinger, Dietmar ; Weigel, Robert ; Koelpin, Alexander

IEEE transactions on microwave theory and techniques, 2018-12, Vol.66 (12), p.5156-5168 [Periódico revisado por pares]

New York: IEEE

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6
3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
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3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices

Seal, Sayan ; Glover, Michael D. ; Mantooth, H. Alan

IEEE transactions on power electronics, 2018-10, Vol.33 (10), p.8553-8564 [Periódico revisado por pares]

New York: IEEE

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7
Hierarchical Attention-Based Machine Learning Model for Radiation Prediction of WB-BGA Package
Hierarchical Attention-Based Machine Learning Model for Radiation Prediction of WB-BGA Package
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Hierarchical Attention-Based Machine Learning Model for Radiation Prediction of WB-BGA Package

Jin, Hang ; Gu, Zhe-Ming ; Tao, Tuo-Min ; Erping, Li

IEEE transactions on electromagnetic compatibility, 2021-12, Vol.63 (6), p.1972-1980 [Periódico revisado por pares]

New York: IEEE

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8
Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys
Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys
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Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys

Hao, Qichao ; Tan, Xin F. ; McDonald, Stuart D. ; Sweatman, Keith ; Akaiwa, Tetsuya ; Nogita, Kazuhiro

Journal of electronic materials, 2024-03, Vol.53 (3), p.1223-1238 [Periódico revisado por pares]

New York: Springer US

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9
The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys
The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys
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The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

Tan, Xin F. ; Hao, Qichao ; Zhou, Jiye ; McDonald, Stuart D. ; Sweatman, Keith ; Nogita, Kazuhiro

Journal of electronic materials, 2024-03, Vol.53 (3), p.1183-1191 [Periódico revisado por pares]

New York: Springer US

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10
Power Conversion With SiC Devices at Extremely High Ambient Temperatures
Power Conversion With SiC Devices at Extremely High Ambient Temperatures
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Power Conversion With SiC Devices at Extremely High Ambient Temperatures

Funaki, T. ; Balda, J.C. ; Junghans, J. ; Kashyap, A.S. ; Mantooth, H.A. ; Barlow, F. ; Kimoto, T. ; Hikihara, T.

IEEE transactions on power electronics, 2007-07, Vol.22 (4), p.1321-1329 [Periódico revisado por pares]

New York, NY: IEEE

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