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The future of military standards. A focus on electronics
The future of military standards. A focus on electronics
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The future of military standards. A focus on electronics

Pecht, M. ; Hakim, E.

IEEE aerospace and electronic systems magazine, 1992-07, Vol.7 (7), p.16-19

IEEE

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2
An assessment of the Qualified Manufacturer List (QML)
An assessment of the Qualified Manufacturer List (QML)
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An assessment of the Qualified Manufacturer List (QML)

Pecht, M.G. ; Fink, J. ; Hakim, E. ; Wyler, J.

IEEE aerospace and electronic systems magazine, 1997-07, Vol.12 (7), p.39-42

IEEE

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3
The realism of FAA reliability-safety requirements and alternatives
The realism of FAA reliability-safety requirements and alternatives
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The realism of FAA reliability-safety requirements and alternatives

Pecht, M. ; Boullie, J. ; Hakim, E. ; Jain, A.K. ; Jackson, M. ; Knowles, I. ; Schroeder, R. ; Strange, A.D.

IEEE aerospace and electronic systems magazine, 1998-02, Vol.13 (2), p.16-20

IEEE

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4
Electronic packaging materials and their properties
Electronic packaging materials and their properties
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Electronic packaging materials and their properties

Shea, J.J.

IEEE Electrical Insulation Magazine, 2001-09, Vol.17 (5), p.60-60

New York: IEEE

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5
Physics of pulsed breakdown in gases
Physics of pulsed breakdown in gases
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Physics of pulsed breakdown in gases

Shea, J.J.

IEEE Electrical Insulation Magazine, 2001-09, Vol.17 (5), p.60-61

New York: IEEE

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6
Cable systems for high and extra-high voltage: development, manufacture, testing, installation and operation of cables and their accessories
Cable systems for high and extra-high voltage: development, manufacture, testing, installation and operation of cables and their accessories
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Cable systems for high and extra-high voltage: development, manufacture, testing, installation and operation of cables and their accessories

Shea, J.J.

IEEE Electrical Insulation Magazine, 2001-09, Vol.17 (5), p.60-60

New York: IEEE

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7
Airborne operation of portable electronic devices
Airborne operation of portable electronic devices
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Airborne operation of portable electronic devices

LIn Li ; JIngsong Xie ; Ramahi, O.M. ; Pecht, M. ; Donham, B.

IEEE antennas & propagation magazine, 2002-08, Vol.44 (4), p.30-39

New York, NY: IEEE

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8
An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses
An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses
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An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses

Weifeng Liu ; Mikyoung Lee ; Pecht, M. ; Martens, R.

IEEE transactions on device and materials reliability, 2003-06, Vol.3 (2), p.39-43 [Periódico revisado por pares]

Piscataway, NJ: IEEE

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9
Hygroscopic swelling of encapsulated microcircuits PART I: new measurement technique shows the deformation
Hygroscopic swelling of encapsulated microcircuits PART I: new measurement technique shows the deformation
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Hygroscopic swelling of encapsulated microcircuits PART I: new measurement technique shows the deformation

Han, B ; Stellrecht, E ; Pecht, M

Advanced packaging, 2003-06, Vol.12 (6), p.31-33

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10
Part II: Hygroscopic swelling of encapsulated microcircuits. Moisture expansion can cause more stress than thermal expansion
Part II: Hygroscopic swelling of encapsulated microcircuits. Moisture expansion can cause more stress than thermal expansion
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Part II: Hygroscopic swelling of encapsulated microcircuits. Moisture expansion can cause more stress than thermal expansion

Han, B ; Stellrecht, E ; Pecht, M

Advanced packaging, 2003-07, Vol.12 (7), p.29-30

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