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To cut or not to cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures
To cut or not to cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures
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To cut or not to cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures

Pecht, M. ; Xin Wu ; Paik, K.W. ; Bhandarkar, S.N.

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1995-02, Vol.18 (1), p.150-153

New York, NY: IEEE

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2
Influence of temperature on microelectronics and system reliability
Influence of temperature on microelectronics and system reliability
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Influence of temperature on microelectronics and system reliability

Pradeep Lall Michael Pecht; Edward B Hakim

Boca Raton CRC Press c1997

Localização: EPELM - Esc. Politécnica-Bib Eng Elet., Mec. e Naval    (621.3.049.77 L154i )(Acessar)

3
Plastic-encapsulated Microcircuits (PEMs) : Long-term Dormancy Studies
Plastic-encapsulated Microcircuits (PEMs) : Long-term Dormancy Studies
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Plastic-encapsulated Microcircuits (PEMs) : Long-term Dormancy Studies

Hakim, E.B. ; Fink, J. ; Tam, S.M. ; McCluskey, P. ; Pecht, M.

Circuit world, 1997-12, Vol.23 (4), p.26-29 [Periódico revisado por pares]

Bradford: MCB UP Ltd

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4
Extending the limits of air-cooling in microelectronic equipment
Extending the limits of air-cooling in microelectronic equipment
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Extending the limits of air-cooling in microelectronic equipment

Rodgers, P. ; Eveloy, V. ; Pecht, M.G.

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.695-702

IEEE

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5
Room temperature soldering of microelectronic components for enhanced thermal performance
Room temperature soldering of microelectronic components for enhanced thermal performance
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Room temperature soldering of microelectronic components for enhanced thermal performance

Subramanian, J.S. ; Rodgers, P. ; Newson, J. ; Rude, T. ; He, Z. ; Besnoin, E. ; Weihs, T.P. ; Eveloy, V. ; Pecht, M.

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.681-686

IEEE

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6
Prognostics and Health Monitoring of Electronics
Prognostics and Health Monitoring of Electronics
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Prognostics and Health Monitoring of Electronics

Pecht, M.

2006 International Conference on Electronic Materials and Packaging, 2006, p.1-10

IEEE

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7
The Measurement of Ion Diffusion in Epoxy Molding Compounds by Dynamic Secondary Ion Mass Spectroscopy
The Measurement of Ion Diffusion in Epoxy Molding Compounds by Dynamic Secondary Ion Mass Spectroscopy
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The Measurement of Ion Diffusion in Epoxy Molding Compounds by Dynamic Secondary Ion Mass Spectroscopy

Lantz, Leon ; Pecht, Michael G. ; Wood, Mark

IEEE transactions on components and packaging technologies, 2008-09, Vol.31 (3), p.527-535 [Periódico revisado por pares]

New York: IEEE

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8
Encapsulation Technologies for Electronic Applications
Encapsulation Technologies for Electronic Applications
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Encapsulation Technologies for Electronic Applications

Haleh Ardebili, Michael Pecht

San Diego: Elsevier Science 2009

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9
Prognostics and health monitoring for improved qualification
Prognostics and health monitoring for improved qualification
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Prognostics and health monitoring for improved qualification

Pecht, M.

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009, p.1-10

IEEE

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Deste Autor:

  1. Lall, P
  2. Pecht, M
  3. Hakim, E

Neste Assunto:

  1. Microelectronics
  2. Microelectronics
  3. Engineering, Electrical & Electronic
  4. Engineering
  5. Science & Technology

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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