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Applied Sciences
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artigo
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A cyclic two-surface thermoplastic damage model with application to metallic plate dampersKim, Dongkeon ; Dargush, Gary F. ; Basaran, CemalEngineering structures, 2013-07, Vol.52, p.608-620 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
| 2 |
Material Type: Ata de Congresso
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A thermodynamic model for electrical current induced damageBasaran, C. ; Minghui Lin ; Hua Ye2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1738-1745 Vol.2Piscataway NJ: IEEETexto completo disponível |
| 3 |
Material Type: Artigo
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A thermodynamic model for electrical current induced damageBasaran, Cemal ; Lin, Minghui ; Ye, HuaInternational journal of solids and structures, 2003-12, Vol.40 (26), p.7315-7327 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 4 |
Material Type: Ata de Congresso
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An analytical model for thermal stress analysis of multi-layered microelectronics packagingYujun Wen ; Basaran, C.2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1592-1601 Vol.2Piscataway NJ: IEEETexto completo disponível |
| 5 |
Material Type: Artigo
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Analysis of multi-layered microelectronic packaging under uniformly distributed loadingWen, Yujun ; Basaran, CemalInternational journal of solids and structures, 2003-06, Vol.40 (13), p.3331-3345 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
| 6 |
Material Type: Artigo
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Closed form vs. finite element analysis of laminated stacksBasaran, Cemal ; Zhao, YingFinite elements in analysis and design, 1999-06, Vol.32 (3), p.163-179 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
| 7 |
Material Type: Artigo
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Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithmGomez, Juan ; Basaran, CemalMechanics of materials, 2006-07, Vol.38 (7), p.585-598 [Periódico revisado por pares]Lausanne: Elsevier LtdTexto completo disponível |
| 8 |
Material Type: Artigo
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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental studyYao, Wei ; Basaran, CemalInternational journal of damage mechanics, 2014-03, Vol.23 (2), p.203-221 [Periódico revisado por pares]London, England: SAGE PublicationsTexto completo disponível |
| 9 |
Material Type: Artigo
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Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systemsSHIDONG LI ; ABDULHAMID, Mohd F ; BASARAN, CemalIEEE transactions on advanced packaging, 2009, Vol.32 (2), p.478-485Piscataway, NJ: Institute of Electrical and Electronics EngineersTexto completo disponível |
| 10 |
Material Type: Artigo
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Damage mechanics of microelectronics solder joints under high current densitiesYe, Hua ; Basaran, Cemal ; Hopkins, Douglas C.International journal of solids and structures, 2003-07, Vol.40 (15), p.4021-4032 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
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