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Whole-field strain analysis and damage assessment of adhesively bonded patch repair of CFRP laminates using 3D-DIC and FEA

Kashfuddoja, Mohammad ; Ramji, M.

Composites. Part B, Engineering, 2013-10, Vol.53, p.46-61 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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Título:
Whole-field strain analysis and damage assessment of adhesively bonded patch repair of CFRP laminates using 3D-DIC and FEA
Autor: Kashfuddoja, Mohammad ; Ramji, M.
Assuntos: A. Carbon fiber ; Application fields ; Applied sciences ; C. Finite element analysis (FEA) ; carbon ; Digital image correlation (DIC) ; epoxides ; Exact sciences and technology ; finite element analysis ; Forms of application and semi-finished materials ; Laminates ; Polymer industry, paints, wood ; prediction ; Technology of polymers
É parte de: Composites. Part B, Engineering, 2013-10, Vol.53, p.46-61
Notas: http://dx.doi.org/10.1016/j.compositesb.2013.04.030
Descrição: The problem of damage evolution in composite structures, the way it propagates, performance and behavior is of paramount importance in utilizing them for structural applications. In the present work, an experimental study is carried out using digital image correlation (DIC) technique to analyze the behavior of adhesively bonded patch repair of carbon/epoxy unidirectional composite laminates under tensile loading. The damaged panel is repaired with both double and single sided circular patch made of same parent material. Damage initiation and propagation in notched and repaired panel as well as patch debonding is studied using 3D-DIC. Also a 3-D finite element analysis is carried out and obtained strain values are compared with the experimental prediction. They are found to be in good agreement.
Editor: Kidlington: Elsevier Ltd
Idioma: Inglês

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Whole-field strain analysis and damage assessment of adhesively bonded patch repair of CFRP laminates using 3D-DIC and FEA

Kashfuddoja, Mohammad ; Ramji, M.

Kidlington: Elsevier Ltd

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